Conductor arrangement layering structure formed in contact hole, manufacturing method of conductor arrangement layering structure and display device having said conductor arrangement layering
A layered structure and display device technology, applied in the direction of layered products, lighting devices, electrode devices and related components, can solve problems such as burrs and display device defects
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
no. 1 example
[0041] The wiring layered structure according to the first embodiment of the present invention is used to drive TFTs of a display device including organic EL elements. figure 1 is a plan view showing part of the display device. The display device 100 includes a figure 1 The dashed lines in the figure indicate the display area 110 on the insulating substrate 10, and the peripheral driving circuits 120 and 130 for driving the TFTs in the display area. A plurality of scan lines G1 to Gm are connected to the peripheral driving circuit 120 , and a plurality of data lines D1 to Dn are connected to the peripheral driving circuit 130 .
[0042] refer to figure 1 , displayed in the display area 110 is a circuit diagram for a display pixel near the intersection of the scan line Gk and the data line Dk. The display pixel includes an organic EL element 60, a first TFT 30, a second TFT 40 and a capacitor C.
[0043] The gate electrode in the first TFT 30 is connected to the scanning...
no. 2 example
[0067] Figure 4 is a schematic diagram for explaining the second embodiment of the present invention.
[0068] In the first embodiment, the description is directed to the case where the second protective metal layer 174 is formed thicker than the gate insulating film 12 . However, in this second embodiment, the second protective metal layer 174 is formed such that the film thickness d5 of the second protective metal layer 174 is greater than the distance d4 between the tip of the arm and the gate insulating film 12 under the arm. Thus, even when an overhang is formed on the boundary between the first interlayer insulating film 13 and the gate insulating film 12, the second protective metal layer 174 will be formed without any breakage. As a result, the occurrence of burrs growing from the drain electrode 53 and the source electrode 54 can be suppressed. Therefore, as shown in FIG. 2, when the cathode 67 of the organic EL element 60 is formed on the entire surface of the dra...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 