Chip fixing device for finding chip defect by luminous microscope

Abstract

This invention relates to a chip fixing device used in emission microscope to find out chip defection, which comprises the following parts: one printing circuit with multiple electrically connected lines to provide power to chips fixed on the observation window; one observation window made of transparent materials located on the printing circuit board; one fixing board located on the down layer of the printing circuit board. The multiple connection lines are printed around observation window and are isolated between each other to supply power to the chip. Each connection line is located with one line terminal around the printing circuit board edge.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a chip fixing device used for an emission microscope (emission microscope, EMMI) to find chip defects. Background technique [0002] In the semiconductor industry, functional testing of packaged semiconductor chips is an essential technology to improve the yield of chips. Among them, the light-emitting microscope is an important tool for finding the defect position on the integrated circuit. The principle is: When a voltage is applied to the chip, when there is a defect in a certain component of the chip, the defect will emit abnormal infrared light radiation. The light-emitting microscope uses this abnormal infrared light radiation to find the exact location of the defect on the chip. position, and then the failure analysis engineer (failure analysis engineer) can conduct further research on the chip to find out the root cause, thereby improving the final yie...

AI Technical Summary

Problems solved by technology

[0003] With the rapid development of the speed and integration of silicon chips, the metal layer on a chip has reached up to 8 layers. Because these metals block the light, EMMI cannot detect the light emitted by the defect from the front of the chip, thus developing from The technology of detecting defects on the back of the chip, however, the traditional method is to use a complex special tool to dig out a window of a specific size on the back of the chip, remove the package plastic, lead frame, etc., then polish the back, and put the chip Place it in a special-sized card slot, and then search for defects...During this process, digging the window is an extremely time-consuming and difficult to control work, and each commercially available card slot can only be used for one size Chips with low versatility will cause a waste of cost, and it will take a few days to find only one defect! really should be improved

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