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Welded area structure of printed circuit board for washing machine controller

A technology for printed circuit boards and soldering areas, which is applied in the field of soldering area structures, can solve problems such as weak bonding and semiconductor element 200 falling off, and achieve the effects of improving bonding force, improving installation reliability, improving productivity and product reliability

Inactive Publication Date: 2009-01-14
LG ELECTRONICS (TIANJIN) APPLIANCES CO LTD
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AI Technical Summary

Problems solved by technology

[0022] In addition, in order to remove the coated urethane, it is necessary to remove a coating guide (not shown in the drawings) surrounding the urethane coating layer, and the above-mentioned urethane coating is removed when the coating guide is removed. In the case where the coating is lifted together, in the prior art, the semiconductor element 200 is frequently peeled off from the printed circuit board due to the relatively weak combination of the above-mentioned fixing pin 200a and the soldering area 100a.

Method used

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  • Welded area structure of printed circuit board for washing machine controller
  • Welded area structure of printed circuit board for washing machine controller
  • Welded area structure of printed circuit board for washing machine controller

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Embodiment Construction

[0034] Refer to the attached image 3 , the embodiment of the welding structure of the printed circuit board of the washing machine controller of the present invention will be described in detail.

[0035] image 3 A longitudinal sectional view showing the main part of the present invention.

[0036] like image 3 As shown, the printed circuit board of the washing machine controller includes the following structures: a printed circuit board body 100 , a semiconductor element 200 and a urethane coating layer. A circuit pattern (pattern) is formed on the above-mentioned printed circuit board body 100; a plurality of the above-mentioned semiconductor elements 200 are installed on the above-mentioned printed circuit board body 100; And semiconductor element 200 invades; To the printed circuit board of above-mentioned controller, the printed circuit board structure of the controller that the present invention provides has following feature: the bottom surface (bottom surface) in...

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Abstract

The improved structure increases binding force between fixed pins of semiconductor element and printing circuit board (PCB). The PCB of washing machine controller includes a PCB, semiconductor elements, and urethane coating. Circuit diagram is formed on PCB, and semiconductor elements are installed on PCB. Urethane coating is utilized to prevent moisture from intruding into semiconductor elements on PCB. Weld zone extending certain distance towards direction of inside underside of the said fixed pins forms the invented weld zone.

Description

technical field [0001] The invention relates to a printed circuit board of a washing machine controller. To further illustrate, it relates to an improved structure of solder land on PCB for controller in washing machine, which can improve the bonding force between the fixing pin of the semiconductor element and the printed circuit board. Background technique [0002] Generally, the washing machine uses the gentle action of the detergent, the friction of the water flow generated by the rotation of the washing fins, and the additional impact action of the agitator on the laundry to remove the pollutants attached to the clothes and bedding. The above-mentioned washing machine senses the amount and type of laundry through sensors, automatically sets the washing method for washing, or supplies washing water to an appropriate water level according to the amount and type of laundry and then performs washing under the control of a computer. [0003] In addition, the washing machine...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34D06F33/02
Inventor 洪权基
Owner LG ELECTRONICS (TIANJIN) APPLIANCES CO LTD
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