Positioning assembling device for contact pin tinning process and contact pin tinning method

Abstract

The invention discloses a locating industrial mounting device in a pin soldering process, and the device includes: straight leader, brackets and locating pin, where two ends of the straight leader are connected vertically with the brackets, respectively, the distance tolerance between the acting height of a straight leading part in the straight leader and a pin plastic pad is between 0 and a preset tolerance, and the difference value between the pin-pin distance and the width of the straight leading part is between o and a corresponding preset tolerance. The invention also discloses a pin soldering method using the locating industrial mounting device, including the following steps: firstly, inserting pins in a circuit board, inserting the locating industrial mounting device on the circuit board by the locating pin to make the leading part of the straight leader act on the pins; and then making pin soldering.

Description

technical field [0001] The invention relates to the field of circuit board processing, in particular to the field of tin-passing technology for pins on the circuit board. Background technique [0002] The pin is an electronic component widely used on the circuit board. The pin has a variety of specifications, including connector type, patch type, single row, double row, multi-row, and according to different needs, the pin The size will also vary. This article is for connector-type pins. Its structure is like figure 1 shown. exist figure 1 In the illustrated pin structure, the pins are composed of a plurality of identical units, and the number of combined units of the pins and the number of rows of pins in each combined unit can vary according to actual needs. In the process of circuit board processing, a tinning process is required, which is also called reflow soldering, which is a process in which components inserted on the circuit board are soldered to the circuit boa...

AI Technical Summary

Problems solved by technology

[0004] 1) After the pin is inserted into the circuit board, it is easy to tilt without auxiliary fixing, resulting in the pin being not perpendicular to the circuit board after welding;

[0005] 2) Due to the buoyancy of the tin and the heat deformation of the single board when passing the tin, it is easy to make the pins float, resulting in inaccurate dimensions of the pins in the height direction, and easy to form virtual soldering

[0015] (1) The production cycle is long and the work efficiency is low: because the tinning process requires the process of dispensing red glue, and because the red glue takes a long time to cure, the circuit board needs to be removed from the production line, etc., which will result in time-consuming, affect the rhythm of the production line, and damage Disadvantages of process balance;

[0016] (2) Due to the use of red glue dispensing steps and the need to move the circuit board out of the production line to wait for the red glue to cure, it will cause temporary use of the site and turnover equipment;

[0017] (3) The use of red glue will increase the cost of the tin process;

[0018] (4) Low product quality: When dispensing red glue, rely on the operator's operating skills to ensure that the pins are in vertical and complete contact with the circuit board. Due to the large randomness of the operator, it will cause poor soldering quality of the circuit board after the tinning process Stable; at the same time, because the circuit board needs to be moved out of the production line when the red glue is not cured, the pins may be tilted during the moving process, and the tilt may cause poor soldering quality of the circuit board after the tinning process

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