Packaging method for integrated circuit and LED
A technology of light-emitting diodes and integrated circuits, which is applied to circuits, electrical components, and electric solid-state devices, etc., can solve the problems of high cost and practicability, and achieve the effect of improving practicability and reducing costs.
Inactive Publication Date: 2009-02-11
MUTUAL PAK TECH
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Problems solved by technology
[0007] In order to overcome the shortcomings of high cost and poor practicability of the existing packaging methods for integrated circuits and light-emitting diodes, the present invention provides a packaging method suitable for integrated circuits and light-emitting diodes, which can avoid the problem of forming metal bumps on integrated circuits. Complex process to achieve the effect of reducing costs, and can be widely used in the packaging of various integrated circuits and light-emitting diodes to improve the practicability of the packaging process
Method used
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Embodiment Construction
[0046] see figure 1 , a packaging method applicable to integrated circuits of the present invention includes the following processes:
[0047] A metal substrate 10 made of a copper material is used as a process substrate (see figure 1 shown in A);
[0048] Etching the top of the metal substrate 10, the etched recess on the metal substrate 10 is filled with a polymer dielectric material 11, and the unetched part forms a circuit (see figure 1 as shown in B);
[0049] By means of electroplating or printing, several metal bumps 12 are formed on the circuit surface of the metal substrate 10 (see figure 1 C shown);
[0050] A metal bonding agent 13 made of silver paste or solder paste is coated on the outside of each metal bump 12 (please refer to figure 1 as shown in D);
[0051] A conductive body 15 that can be a chip IC or a light-emitting diode LED chip is arranged on the metal bump 12, wherein several metal contacts 151 on the conductive body 15 are respectively corr...
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Disclosed a packaging method for integrate circuit and light-emitting diode comprises following steps: using a metal base plate as the base plate of said process; arranging a circuit on the base plate; forming several metal projections on the surface of the circuit on the metal base plate; arranging a conductive main body on the metal projections; sealing covering a packaging paste on the outer part of said conductive main body; etching the bottom of metal base plate to form pins; and plating anti-weld ink on the area without pins of the bottom of metal base plate. With aforementioned technical method, The invention can avoid the complex process that forming metal projections on the IC crystal or light-emitting diode to reduce the cost while it can widely used in the package of variable IC component conductive main body to improve the practicability of package.
Description
technical field [0001] The invention relates to a packaging method suitable for integrated circuits and light emitting diodes. Background technique [0002] Today's semiconductor technology has been widely used in various electronic devices encountered in people's lives. For example, personal computers, mobile phones and automatic teller machines, etc., all contain circuit boards or other electronic components manufactured with semiconductor and other technologies. . [0003] see Figure 5 and Image 6 , is a general traditional semiconductor integrated circuit IC (Integrated Circuit) or light emitting diode LED (Light Emitting Diode) packaging process, which is to set a chip (chip) 70 on a metal lead frame 60, 60a or copper foil substrate, commonly known as packaging Chip or light-emitting diode chip (diode crystal grain) 70a, then, between the chip 70 or chip 70a and the pin 61, 61a on the lead frame 60, 60a or the welding point on the copper foil substrate, put the weld...
Claims
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IPC IPC(8): H01L21/50H01L21/60H01L21/56H01L33/00H01L33/48H01L33/62
CPCH01L2924/15311H01L2924/3011H01L2224/73204H01L2224/48091H01L2224/16245H01L2224/16225H01L2924/30107H01L2224/48247H01L2924/00014H01L2924/00
Inventor 黄禄珍
Owner MUTUAL PAK TECH