Component mounting method and component mounting apparatus
一种安装方法、安装装置的技术,应用在用电元件组装印刷电路、电气元件、电气元件等方向,能够解决没有进行补偿控制、导通不良、IC芯片易残留加工应变等问题,达到缩短安装时间的效果
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0046] This embodiment shows how to mount an IC chip on a substrate by fusing and bonding the electrode of an IC chip as an example of an electronic component into a solder bump as a protruding electrode and forming a pad as a substrate electrode with an electrode of a substrate. The component installation method and component installation device on the above. In particular, it is a mounting control method and device thereof capable of mounting with high precision even IC chips whose planarity tends to be impaired due to thinning or IC chips in which a plurality of electrodes are arranged in a row at a narrow pitch. In addition, the object to mount the IC chip is set as the board, but it is not only the circuit board, and in the case of chip-on-chip mounting the IC chip on the IC chip, the IC chip to be mounted is set as the board.
[0047] figure 1 Shown is the main configuration of the mounting device according to the embodiment, and shows the components of the mounting he...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com