Loading table and heat treating apparatus having the loading table

Abstract

A heat treating apparatus, wherein a treated body (W) is placed on the upper surface of a loading table (32) which is erected from the bottom part of a treatment container (4) through a column and in which a heating means (38) is buried and a specified heat treatment is applied to the treated body. Insulating cover members (72), (74), and (76) are installed on the upper surface, side surface, and lower surface of the loading table. Thus, since metallic atoms causing contamination can be prevented from being thermo-diffused from the loading table, various contaminations such as metallic contamination and organic substance contamination can be prevented from occurring.

Description

technical field [0001] The present invention relates to a placing table structure for placing an object to be processed such as a semiconductor wafer, and a heat treatment apparatus having the placing table structure. Background technique [0002] Generally, in the manufacture of semiconductor integrated circuits, various single-chip processes such as film formation, etching, heat treatment, modification, and crystallization are repeatedly performed on a target object such as a semiconductor wafer to form a desired integrated circuit. . In the case of performing the above-mentioned various treatments, it is necessary to introduce necessary processing gases into the processing container according to the type of processing. It is necessary to introduce ozone gas, etc., and in the case of crystallization treatment, it is necessary to introduce N 2 Inert gas such as gas or O 2 gas etc. [0003] For example, taking a monolithic heat treatment apparatus that heats each of semi...

AI Technical Summary

Problems solved by technology

In this case, since the heat emissivity is different on the thicker part and the thinner part of the attached unnecessary film, so, with it as a reason, the surface temperature of the mounting table is distributed, so that the wafer surface is caused Temperature unevenness, which reduces the in-plane uniformity of the heat treatment of the wafer

[0009] In addition, since the unnecessary film attached to the surface of the table or the surface of the cover is easy to peel off quickly, it is necessary to perform cleaning treatment before the unnecessary film peels off to shorten the maintenance interval of cleaning treatment and the like. , therefore, frequent maintenance operations are necessary

In addition, in the case where heating can be performed for each area of ​​the placement table as a heating body, when the difference in power input to each area is large, due to the thermal expansion of the material of the heater, the placement table may be damaged. Damage and other issues

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