Precise resistive Cu-Mn-Ga-Ge alloy and preparation method thereof
A precision resistor, copper-manganese technology, applied in the manufacture of resistors, resistors, metal/alloy conductors, etc., can solve problems such as easy broken wires, no introduction of average temperature coefficient of resistance temperature coefficient, increase of temperature coefficient of resistance, etc.
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Embodiment 1
[0021] Each component of the alloy is formulated according to the content of 8.6% Mn, 8.5% Ga, 1.0% Ni, and the balance of Cu. It is melted with a high-purity alumina crucible and a high-frequency induction furnace. When melting, the melting chamber is first evacuated to 10 -3 ~10 -5 mmHg, filled with an inert protective gas such as argon, the alloy should be fully degassed in the molten state to increase the density of the ingot, and finally cast in a water-cooled copper mold, and the ingot is prepared by forging, rolling, and drawing to a diameter of less than 0.08 mm of filament, followed by high-purity H 2 After continuous annealing treatment at 400°C under protection, it was treated in methyl silicone oil at 80°C for 5 hours. Finally, its resistivity was determined to be 43μΩ·cm, and the average temperature coefficient of resistance from -60 to +125°C was -2.0×10 -6 / ℃, the tensile strength is 550N / mm 2 , the thermal potential Ecu of copper is -1.2μV / ℃.
Embodiment 2
[0023] Each component of the alloy is formulated according to the content of 8.6% Mn, 7.5% Ga, 2.5% Ge, 2.0% Ni, and the remaining amount of Cu. It is melted in a high-purity alumina crucible and a high-frequency induction furnace. When melting, the melting chamber is first evacuated. to 10 -3 ~10 -5 mmHg, filled with an inert protective gas such as argon, the alloy should be fully degassed in the molten state to increase the density of the ingot, and finally cast in a water-cooled copper mold, and the ingot is prepared by forging, rolling, and drawing to a diameter of less than 0.08 mm of filament, followed by high-purity H 2 After continuous annealing treatment at 600°C under protection, it was treated in methyl silicone oil at 150°C for 50 hours. Finally, the resistivity was determined to be 45μΩ·cm, and the average temperature coefficient of resistance from -60 to +125°C was -5.0×10 -6 / ℃, the tensile strength is 620N / mm 2 , The thermoelectric potential Ecu of copper i...
Embodiment 3
[0025] Each component of the alloy is formulated according to the content of 8.6% Mn, 8.5% Ga, 1.5% Ge, 2.0% Ni, and the remaining amount of Cu. It is melted in a high-purity alumina crucible and a high-frequency induction furnace. When melting, the melting chamber is first evacuated. to 10 -3 ~10 -5 mmHg, filled with an inert protective gas such as argon, the alloy should be fully degassed in the molten state to increase the density of the ingot, and finally cast in a water-cooled copper mold, and the ingot is prepared by forging, rolling, and drawing to a diameter of less than 0.08 mm of filament, followed by high-purity H 2 After continuous annealing treatment at 750°C under protection, it was treated in methyl silicone oil at 300°C for 100 hours. Finally, the resistivity was determined to be 43μΩ·cm, and the average temperature coefficient of resistance from -60 to +125°C was -3.0×10 -6 / ℃, the tensile strength is 610N / mm 2 , the thermal potential Ecu of copper is -1.5...
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