Precise resistive Cu-Mn-Ga-Ge alloy
A precision resistance, copper-manganese technology, used in resistors, resistance manufacturing, metal/alloy conductors, etc., can solve the problem of increasing the temperature coefficient of resistance, not introducing the average temperature coefficient of resistance, and not introducing the temperature range of alloy use, etc. question
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Embodiment 1
[0021] Each component of the alloy is formulated according to the content of 8.6% Mn, 8.5% Ga, 1.0% Ni, and the balance of Cu. It is melted with a high-purity alumina crucible and a high-frequency induction furnace. When melting, the melting chamber is first evacuated to 10 -3 ~10 -5 mmHg, filled with an inert protective gas such as argon, the alloy should be fully degassed in the molten state to increase the density of the ingot, and finally cast in a water-cooled copper mold, and the ingot is prepared by forging, rolling, and drawing to a diameter of less than 0.08 mm of filament, followed by high-purity H 2 After continuous annealing treatment at 400°C under protection, it was treated in methyl silicone oil at 80°C for 5 hours. Finally, its resistivity was determined to be 43μΩ·cm, and the average temperature coefficient of resistance from -60 to +125°C was -2.0×10 -6 / ℃, the tensile strength is 550N / mm 2 , the thermal potential Ecu of copper is -1.2μV / ℃.
Embodiment 2
[0023] Each component of the alloy is formulated according to the content of 8.6% Mn, 7.5% Ga, 2.5% Ge, 2.0% Ni, and the remaining amount of Cu. It is melted in a high-purity alumina crucible and a high-frequency induction furnace. When melting, the melting chamber is first evacuated. to 10 -3 ~10 -5 mmHg, filled with an inert protective gas such as argon, the alloy should be fully degassed in the molten state to increase the density of the ingot, and finally cast in a water-cooled copper mold, and the ingot is prepared by forging, rolling, and drawing to a diameter of less than 0.08 mm of filament, followed by high-purity H 2 After continuous annealing treatment at 600°C under protection, it was treated in methyl silicone oil at 150°C for 50 hours. Finally, the resistivity was determined to be 45μΩ·cm, and the average temperature coefficient of resistance from -60 to +125°C was -5.0×10 -6 / ℃, the tensile strength is 620N / mm 2 , The thermoelectric potential Ecu of copper i...
Embodiment 3
[0025] Each component of the alloy is formulated according to the content of 8.6% Mn, 8.5% Ga, 1.5% Ge, 2.0% Ni, and the remaining amount of Cu. It is melted in a high-purity alumina crucible and a high-frequency induction furnace. When melting, the melting chamber is first evacuated. to 10 -3 ~10 -5 mmHg, filled with an inert protective gas such as argon, the alloy should be fully degassed in the molten state to increase the density of the ingot, and finally cast in a water-cooled copper mold, and the ingot is prepared by forging, rolling, and drawing to a diameter of less than 0.08 The wire material of mm is then treated in methyl silicone oil at 300°C for 100 hours under the protection of high-purity H2 and continuously annealed at 750°C. Finally, the resistivity was determined to be 43μΩ·cm, and the average temperature coefficient of resistance from -60 to +125°C was -3.0×10 -6 / ℃, the tensile strength is 610N / mm 2 , The thermoelectric potential Ecu of copper is -1.5μV / ...
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