Substrate processing device and substrate processing system

A substrate processing device and substrate technology, applied in the direction of transportation and packaging, conveyor objects, electrical components, etc., can solve problems such as difficult to ensure installation space, achieve the effects of reduced area, easy maintenance operations, and suppressed floor space

Active Publication Date: 2009-06-17
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this cover opening and closing device, since the rotation center of the cover is the height position at which the cover is raised and slid in the horizontal direction, when the rotation radius of the cover is considered, it is difficult to reach the installation place (clean room) The relationship between the height of the patio part and the head size of the lifting equipment, but there are restrictions
In particular, in recent years, as substrates to be processed have grown in size, for example, substrates with a length of longer than 2 m have been used as processing objects. Therefore, substrate processing equipment has also become larger, so it is difficult to ensure The required installation space for the height of the patio section, etc.

Method used

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  • Substrate processing device and substrate processing system
  • Substrate processing device and substrate processing system
  • Substrate processing device and substrate processing system

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Embodiment Construction

[0088] Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

[0089] Here, the case where the substrate processing apparatus of the present invention is used in a multi-chamber vacuum processing system for etching a glass LCD substrate (hereinafter simply referred to as "substrate") S will be described.

[0090] FIG. 1 is a schematic perspective view showing the vacuum processing system 1, figure 2 is a horizontal sectional view showing its interior. In this vacuum processing system 1, the central part is connected to the transfer chamber 20 and the load lock chamber 30 which are transfer units. Three etching processing apparatuses 10 are arranged around the transfer chamber 20 as processing modules. In addition, between the transfer chamber 20 and the load lock chamber 30, between the transfer chamber 20 and each etching processing apparatus 10, and on the openings communicating the load lock chamber 30 and the outsid...

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Abstract

To provide a device for processing a substrate capable of suppressing a device-space required for opening and closing a cover. The cover 62 is slightly raised from a state with the cover 62 press contacted to a chamber body 61 in air-tight manner by actuating elevating motors 107 and 127. Next, the cover 62 is slide moved holizontally along guide rails 201, 202 arranged at different heights on both sides of a processing chamber 60. After the cover 62 is slid to a position deviated from a chamber body 61, the cover 62 is lowered and rotated at the position after it is lowered.

Description

technical field [0001] The present invention relates to a substrate processing apparatus and a substrate processing system for performing predetermined processing on substrates such as FPD (Flat Panel Display) substrates typified by liquid crystal display (LCD) substrates. Background technique [0002] In the prior art, for example, in the manufacturing process of LCD substrates, a so-called multi-chamber vacuum system is used, which has a plurality of substrate processing equipment that performs predetermined processes such as etching, ashing, and film formation on LCD substrates in a reduced-pressure atmosphere. processing system. [0003] This vacuum processing system includes: a transfer chamber provided with a substrate transfer mechanism having a transfer arm for transferring substrates, and a plurality of substrate processing apparatuses arranged around the transfer chamber. In the processing chamber of the processing device, at the same time, the processed substrate...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23F1/08
CPCB65G49/063B65G49/067H01L21/67196H01L21/67766H01L21/67772H01L21/67778
Inventor 盐野胜美出口新悟
Owner TOKYO ELECTRON LTD
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