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Fabricating method for semiconductor device

A manufacturing method, semiconductor technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of high price, heavy maintenance burden, cutting off, etc., achieve low-cost manufacturing, and ease thermal stress Influence of badness, effect of ensuring reliability

Inactive Publication Date: 2009-07-15
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] (1) In order to seal the leads and the entire bare chip with resin, a mold is required and a huge investment in equipment is required
In addition, there is also a problem that the maintenance burden on molds and other machines and equipment for resin encapsulation is large
[0007] (2) During heating processes such as solder reflow, stress is generated due to the difference in thermal expansion coefficient between the sealing resin and the bare chip, and cracking or chipping of the bare chip may occur
Or it is also possible to cut the connection of the lead
[0008] (3) When the semiconductor element is an optical element, the transparent resin used is more expensive than the general opaque black resin, etc.

Method used

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  • Fabricating method for semiconductor device
  • Fabricating method for semiconductor device
  • Fabricating method for semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0034] figure 1 It is a plan view showing the structure of the semiconductor device 10 according to the first embodiment of the present invention. This semiconductor device 10 is a device in which a bare chip 11 on which a semiconductor element is formed is mounted on a substrate 17 .

[0035] The substrate 17 is, for example, rectangular. The chip stage 12 is formed at the center of the substrate 17 , and a plurality of electrode terminals 14 connectable to the outside are formed along each side of the substrate 17 near the outer edge of the substrate 17 .

[0036] The bare chip 11 is mounted on the chip stage 12 of the substrate 17 . The outer shape of the bare chip 11 is also rectangular. On the bare chip 11 , a plurality of electrode pads 13 are formed along the outer periphery of each side of the bare chip 11 . The electrode pads 13 of the bare chip 11 and the electrode terminals 14 of the substrate 17 are electrically connected by wires 15 .

[0037] In addition, all...

no. 2 Embodiment approach

[0057] Image 6 It is a plan view showing the semiconductor device 20 according to the second embodiment of the present invention.

[0058] This semiconductor device 20 is a device in which a bare chip 11 in which a semiconductor element is formed is mounted on a substrate 17 .

[0059] The substrate 17 is, for example, rectangular, and the chip stage 12 is formed at the center of the substrate 17 , and a plurality of electrode terminals 14 that can be connected to the outside are formed along each side near the outer edge of the substrate 17 .

[0060] The bare chip 11 is mounted on the chip stage 12 of the substrate 17 . The outer shape of the bare chip 11 is also rectangular. On the bare chip 11, a plurality of electrode pads 13 are formed along each side. The electrode pads 13 of the bare chip 11 and the electrode terminals 14 of the substrate 17 are electrically connected by wires 15 .

[0061] In addition, all electrode pads 13 and leads 15 arranged on four sides of ...

no. 3 Embodiment approach

[0082] Figure 10It is a plan view of the semiconductor device 30 according to the third embodiment of the present invention.

[0083] This semiconductor device 30 is a device in which a bare chip 11 on which an optical element 18 such as a light emitting diode or a laser diode is formed is mounted on a substrate 17 .

[0084] The semiconductor device 30 of this embodiment has the same structure as that of the first embodiment except that the optical element 18 is formed on the bare chip 11 . The same reference numerals are assigned to the same parts as those in the first embodiment, and detailed description thereof will be omitted.

[0085] The substrate 17 is, for example, rectangular, and the chip stage 12 is formed at the center of the substrate 17 , and a plurality of electrode terminals 14 that can be connected to the outside are formed along each side near the outer edge of the substrate 17 .

[0086] The bare chip 11 is mounted on the chip stage 12 of the substrate 1...

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Abstract

The invention provides a manufacturing method of semiconductor devices, which could manufacture reliable semiconductor devices with low-cost. This manufacturing method includes the installation procedure that a bare chip (11) which contains semiconductor components is installed on the substrate (17) with terminal electrode (14); It also includes the connection procedure that the welding electrodes (13)which is formed on the bare chips (11) is connected with the electrode terminal (14), with the use of lead (15); It also includes coating procedure that electrode pads (13) and lead (15) are at least covered with resins(16) using the coating method; Through the above mentioned implementation of these processes, a number of semiconductor devices are formed on the substrate (17), and could be separated by cutting procedure.

Description

technical field [0001] The present invention relates to a manufacturing method of a semiconductor device, in particular to a manufacturing method of a semiconductor device in which a resin is coated on a substrate mounted with a plurality of bare chips. Background technique [0002] In semiconductor devices, in order to protect metal parts such as electrode pads and leads from moisture and dust, it is necessary to prevent these metal parts from coming into contact with the outside air. Therefore, a method of sealing these metal parts with resin is adopted. . [0003] In the conventional manufacture of resin-sealed semiconductor devices, the following steps are generally performed. [0004] That is, a semiconductor device is manufactured through the following steps: a process of mounting a bare chip on which a semiconductor element is formed on a substrate having a predetermined circuit and electrode terminals; The process of electrically connecting the pads; the process of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56H01L23/31
CPCH01L24/97H01L2224/48091H01L2224/48227
Inventor 小野纯石田智彦
Owner TDK CORPARATION