Flexible semiconductor device and identification label
A flexible device, semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the problems of switching temperature limit card substrates, etc., to achieve cost reduction, small transmission distance, low cost Effect
Inactive Publication Date: 2009-08-05
KONINKLIJKE PHILIPS ELECTRONICS NV
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Printing metals by sol-gel method is in principle an alternative; however, the transition temperature of this sol-gel precursor to metal limits the choice of card substrates
Method used
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Embodiment Construction
[0046] Figure 1A A substrate 10 is shown having a first face 1 and a second face 2 . Substrate 10 includes single crystal silicon. On top of the substrate is a thermal oxide on which the interconnect structure 3 is arranged. An interconnect structure typically includes 3 to 5 conductive layers separated from each other by a patterned dielectric layer. The interconnect structure 3 interconnects the semiconductor elements defined on the first side of the substrate 10 . In this case the semiconductor elements are CMOS transistors, furthermore diodes are used as rectifiers. The interconnect structure 3 and the semiconductor elements together define an integrated circuit 5 . In addition to the integrated circuit, an antenna 6 is also present. In this embodiment, the antenna 6 is an inductor with one turn.
[0047] Although it is suggested in FIG. 1 that the antenna 6 is located on top of the interconnect structure 3 , in view of the process steps, the antenna 6 is preferably ...
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Abstract
Provided is a flexible device (100) having an integrated circuit (5) and an antenna (6) which is incorporated or directly coupled to the interconnect structure of the integrated circuit (5). An electrically insulating or dielectric layer (4) is present as support layer for both antenna (6) and integrated circuit (5). Preferably the substrate (10) is removed at non-silicon areas (10B) outside the active areas (10A) of the integrated circuit (5). This removal can be combined with the use of a substrate of monocrystalline silicon. The flexible device is very suitable for integration in identification labels and security paper, and can be manufactured using a temporarily attached carrier substrate.
Description
technical field [0001] The present invention relates to a flexible semiconductor device comprising a semiconductor substrate and an integrated circuit provided with a plurality of semiconductor elements defined on the surface of the semiconductor substrate and according to a desired pattern in an interconnection structure And interconnected. [0002] The invention also relates to a security paper comprising the flexible semiconductor device and an identification label comprising the carrier and the flexible semiconductor device. [0003] The invention also relates to a method of communication between a reader and at least one flexible semiconductor device. [0004] The present invention also relates to a method of manufacturing a flexible semiconductor device, comprising the following steps: [0005] providing at least one semiconductor device comprising an integrated circuit provided with a substrate and a plurality of semiconductor elements interconnected according to a de...
Claims
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IPC IPC(8): G06K19/077H01L23/498H01L21/68H01Q1/38H01Q23/00
CPCG06K19/07749H01L2924/0002G06K19/0775H01L2221/68359H01L2924/12044H01L2221/68368H01L23/4985H01L23/49855H01Q1/38H01L21/6835Y10T29/49124H01L2924/3011H01L2924/19041H01Q23/00H01L2924/00
Inventor 罗纳德·德克尔特奥多鲁斯·M·米西尔森安东·M·H·图姆博彼得·W·胡贾曼斯
Owner KONINKLIJKE PHILIPS ELECTRONICS NV