Substrate buffer device and method of buffering substrate, substrate processing apraratus

Abstract

Substrate buffer device 36 can advance to transportation line A. It has a shelf 5 which has putting stand 5a-5f that can put substrate G to which transportation line A is transported at the top and bottom by two or more steps and going up and down mechanism 6 which makes the shelf 5 gone up and down and makes either of the putting stand 5a-5f advance to the transportation line A. Each putting stand 5a-5f has conveyer mechanism 50a-50f that transports the substrate G along the direction of transportation. When each putting stand 5a-5f advances to the transportation line A, each putting stand 5a-5f functions partially of the transportation line A and it puts the substrate G to which transportation line A has been transported by the putting stand 5a that advances to the transportation line A and it goes up and down the shelf 5 with the going up and down mechanism 6 and saves the substrate G of the putting stand 5a from transportation line A.

Description

Technical field [0001] The present invention relates to a substrate buffer device and a substrate buffer method for temporarily retracting a substrate such as a glass substrate used in a flat panel display (FPD) from a transfer line that is conveyed in a certain direction on a conveyance line, and a substrate buffer method having such a substrate A substrate processing device of a buffer device, a control program for performing such a substrate buffer method, and a computer readable storage medium. Background technique [0002] In the manufacture of FPD, photolithography technology is used in order to form a circuit pattern on a glass substrate for FPD. The formation of the circuit pattern by photolithography is carried out in the following order: a resist solution is applied on a glass substrate to form a resist film, and then the resist film is exposed corresponding to the circuit pattern. It is further subjected to development processing, and in the formation of the circuit pa...

AI Technical Summary

Problems solved by technology

[0005] However, FPD tends to increase in size, so that large glass substrates with a side of 2m or more appear, and because the transferability deteriorates with the increase in size of the glass substrate, the above-mentioned conventional buffer that uses the transfer arm to transfer device, not suitable for handling large glass substrates due to safety concerns

Moreover, in this buffer device, since the glass substrate is raised and lowered by the transfer arm like a fan, if the glass substrate becomes large, it is easy to be contaminated with particles, and there is also a possibility that the contaminated particles adhere to the surface of the glass substrate. danger

[0006] In addition, in general, when using a transfer arm that performs complicated movements that require teaching work, as the number of processes increases, the rhythm balance of the entire production line may be disrupted as a result, which may lead to a decrease in productivity.

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