Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Flexible circuit board press bonding method

A flexible circuit board, pressure technology, applied in the direction of chemical instruments and methods, lamination, printed circuit, etc., can solve the problems of difficult equipment, large area, etc., to improve the peel strength, reduce the amount of glue overflow, and reduce the ratio of defective air bubbles Effect

Inactive Publication Date: 2009-12-09
靖江市华信科技创业园有限公司
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The disadvantage of the existing pressing method is that the area of ​​each layer of the existing pressing method is large, which puts forward quite strict requirements on the uniformity of the pressure, temperature and material properties of the equipment, so the existing equipment is difficult to fully meet the above-mentioned Require

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Flexible circuit board press bonding method
  • Flexible circuit board press bonding method
  • Flexible circuit board press bonding method

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0067] The first step of lamination is as follows: figure 1 The process conditions of the laminated plate structure shown are as follows:

[0068] The pressing temperature process conditions of the first step of pressing are as follows:

[0069] Lamination Process Parameters

O

A

B

C

D

temperature(℃)

40

40

190

190

35

time (min)

0

10

55

85

135

[0070] The pressure process conditions of the first step of lamination are as follows:

[0071] Lamination Process Parameters

starting point

Paragraph 1

Paragraph 2

Paragraph 3

Pressure: Pa(×10 6 )

0.62

0.62

2.4

2.1

time (min)

0

10

70

20

[0072] The second step of lamination adopts such as Figure 4 The process conditions of the laminated plate structure shown are as follows:

[0073] Temperature: 180°C;

[0074] Pressu...

specific Embodiment approach 2

[0077] The first step of lamination is as follows: figure 1 The process conditions of the laminated plate structure shown are as follows:

[0078] The pressing temperature process conditions of the first step of pressing are as follows:

[0079] Lamination Process Parameters

O

A

B

C

D

temperature(℃)

70

70

170

170

45

time (min)

0

5

80

125

155

[0080] The pressure process conditions of the first step of lamination are as follows:

[0081] Lamination Process Parameters

starting point

Paragraph 1

Paragraph 2

Paragraph 3

Pressure: Pa(×10 6 )

0.80

0.80

1.8

1.8

time (min)

0

15

90

50

[0082] The second step of lamination adopts such as figure 1 The process conditions of the laminated plate structure shown are as follows:

[0083] Temperature: 170°C;

[0084] Pressur...

specific Embodiment approach 3

[0087] The first step of lamination is as follows: figure 1 The process conditions of the laminated plate structure shown are as follows:

[0088] The pressing temperature process conditions of the first step of pressing are as follows:

[0089] Lamination Process Parameters

O

A

B

C

D

temperature(℃)

100

100

155

155

60

time (min)

0

20

110

170

190

[0090] The pressure process conditions of the first step of lamination are as follows:

[0091] Lamination Process Parameters

starting point

Paragraph 1

Paragraph 2

Paragraph 3

Pressure: Pa(×10 6 )

0.40

0.40

0.55

2.4

time (min)

0

20

120

80

[0092] The second step of lamination adopts such as Figure 4 The process conditions of the laminated plate structure shown are as follows:

[0093] Temperature: 190°C;

[0094] Pr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a pressing method of a flexible circuit board, which comprises the steps of pressing raw materials of the flexible circuit board by adopting a lamination structure, and the pressing includes a pressing step A and a pressing step B in sequence. Using the two-step pressing method of the present invention can significantly reduce the amount of glue overflow, reduce the ratio of defective air bubbles, increase the peeling strength, and improve the performance of the flexible circuit board.

Description

technical field [0001] The invention relates to the manufacture of flexible circuit boards, in particular to a pressing method for flexible circuit boards. Background technique [0002] In recent years, the development of information and communication industries has driven the rapid development of the microelectronics industry. With the miniaturization of electronic products, various electronic components are also developing in the direction of miniaturization and miniaturization. Of course, flexible printed circuit boards carrying various electronic components are no exception, showing a trend of high-density development. The raw materials of flexible circuit boards generally include two layers of cover films and copper foil in the middle of the two layers of cover films. As the requirements for Flexible Printed Circuit (FPC) are getting higher and higher, the cover film used to protect copper foil also requires high bonding strength, heat resistance, acid and alkali resi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00B32B37/00
Inventor 邹凤华章颂云
Owner 靖江市华信科技创业园有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com