Member for circuit board, method for manufacturing circuit board, and apparatus for manufacturing circuit board
A circuit substrate and a manufacturing method technology, applied in the field of manufacturing devices
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Embodiment 1
[0204] As a flexible film, a polyimide film ("Capton" 100EN manufactured by Toray Dupon Co., Ltd.) having a thickness of 25 μm and a thickness of 300 mm×302 mm was prepared.
[0205] On the 1.1mm thick, 300mm square single-sided polished soda lime glass prepared as a reinforcing plate, apply UV-curable adhesive "SK Dyne" SW-22 at a ratio of 100:3 (weight ratio) with a metal die coater (Soken Chemical Co., Ltd.) and curing agent L45 (Soken Chemical Co., Ltd.) were mixed and dried at 80°C for 2 minutes. The thickness of the peelable organic substance layer after drying was made 2 μm. Next, a water vapor blocking film (a film in which a silicone resin layer is provided on a polyester film for easy mold release) was bonded to the organic substance layer, and stored for one week.
[0206] Use on glass with a peelable organic substance layer formed while peeling off the water vapor barrier film formed of the above polyester film and silicone resin layer Figure 17 The lamination d...
Embodiment 2
[0217] A circuit pattern was obtained in the same manner as in Example 1. Next, a model IC chip of 4 mm x 4 mm was heated to 385°C from the IC chip side with a flip chip bonder (Flip chip bonder) FC-70 (manufactured by Toray Engineering Co., Ltd.), The patterned connection pads are metal-connected, and the model IC chip is formed by arranging 60 gold-plated bumps as a row and 4 rows on a square at a pitch of 50 μm. The positions of the bumps of the model IC chip and the connection pads of the circuit pattern are well matched.
[0218] Next, a 20 wt % aqueous solution of polyvinyl alcohol was applied on the circuit pattern as a peeling auxiliary layer, and dried at 90° C. for 20 minutes. The thickness of the polyvinyl alcohol layer after drying was 20 μm.
[0219] In the same manner as in Example 1, the polyimide film with the circuit pattern to which the IC chip was connected was peeled from the glass substrate using the peeling device shown in FIG. 2( a ). But when image...
Embodiment 3
[0222] A circuit pattern was obtained in the same manner as in Example 1.
[0223] Next, solder resist SN-9000 (manufactured by Hitachi Chemical Co., Ltd.) was pattern-printed on the circuit pattern other than the connection pads by using a screen printing machine on the polyimide film formed with the circuit pattern. °C for 30 minutes. Furthermore, it heat-cured at 150 degreeC for 90 minutes, and formed the solder resist layer. The thickness of the solder resist after thermal curing was 20 μm.
[0224] Next, in the same manner as in Example 2, the IC chip and the connection pad of the circuit pattern were metal-connected. The positions of the bumps of the model IC chip and the connection pads of the circuit pattern are well matched.
[0225]In the same manner as in Example 2, the polyimide film with the circuit pattern to which the IC chip was connected was peeled from the glass substrate using the peeling device shown in FIG. 2( a ). The peeling angle between the reinfor...
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