LED encapsulation structure and forming method thereof

Abstract

The invention relates to an LED encapsulation structure, which comprises an LED chip, a cup body for housing the LED chip, an LED encapsulation body and a supporter which extends out of the encapsulation body and is electrically connected with the LED chip. The encapsulation body comprises a multi-layer silica gel, the index of refraction of which is reduced layer by layer from the inside out accordingly to the LED chip. The invention also relates to a molding method of the LED encapsulation structure. The LED encapsulation structure adopts the multi-layer silica gel with the index of refraction reduced layer by layer, which not only provides better heat dissipation, but also avoids the single index of refraction of the encapsulation material, thus increasing the angle of total reflection of an LED lens, improving the utility rate of luminous energy and acquiring the extremely high external quantum efficiency.

Description

technical field [0001] The invention relates to light-emitting components, in particular to an in-line LED packaging structure and a forming method thereof. Background technique [0002] LED (Light Emitting Diode), that is, light emitting diode, is a semiconductor solid light emitting device. It uses solid semiconductor chips as light-emitting materials. When a forward voltage is applied to both ends, the minority interceptors and the majority interceptors in the semiconductor recombine, releasing excess energy and causing photon emission, directly emitting red, orange, yellow, green, blue, blue, purple light. LED light sources are widely used due to their advantages of high energy saving, long life, and environmental protection. [0003] LEDs generally include the following categories: in-line LEDs (DIP LEDs), patch LEDs (SMD LEDs), glue-filled patch LEDs (TOP LEDs), and high-power LEDs (POWER LEDs). Among them, the in-line LED has the advantages of high brightness, high...

AI Technical Summary

Problems solved by technology

Usually, the LED package body 42 is packaged with epoxy resin. Due to the poor heat dissipation of epoxy resin, when the LED is lit, the LED chip 41 will generate a lot of heat, and the epoxy resin cannot dissipate the heat in time, resulting in LED Chip 41 continues to operate at high temperature, resulting in a large light attenuation

[0005] In addition, when the light emitted by the LED luminous material passes through the chip 41 and enters the epoxy resin package, it will be refracted. The refractive index of the material of the chip 41 is usually above 2.0, while the refractive index of the air medium is 1. Because there is only one layer of ring between them. Oxygen resin transition causes the packaging material to have a single refractive index, resulting in a small total reflection angle of the LED lens (that is, the package 42), so that a large part of the light cannot be refracted out of the lens but reflected back into the lens, resulting in a large waste of light energy, resulting in low external quantum efficiency

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