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Method for producing thin semiconductor lighting plane integrated optic source module

A technology of a light source module and a manufacturing method, which is applied to components of lighting devices, semiconductor devices of light-emitting elements, light sources, etc., can solve the problems of many manufacturing process steps and thick light source modules, and achieve improved reliability, life, and luminous flux , The effect of simple production process

Inactive Publication Date: 2007-07-25
上海芯光科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This method has more manufacturing process steps, and the prepared light source module is thicker

Method used

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  • Method for producing thin semiconductor lighting plane integrated optic source module
  • Method for producing thin semiconductor lighting plane integrated optic source module

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Embodiment Construction

[0019] The present invention is described further below, and the present invention is relatively clear to those skilled in the art.

[0020] LED is a high-brightness light-emitting diode, such as GaInN / GaN and other series of LEDs, which can be monochrome or white, and the power of a single LED does not exceed 1W. The specific light source module consists of the following three parts:

[0021] Light-emitting array unit: Firstly, a copper film is plated on the surface of a conventional copper-plated insulating circuit board as a substrate. The thickness of the substrate is 1-3 mm, and the thickness of the copper film is 0.5-5 microns, and then it is composed of any number of LEDs according to the number of LEDs to be installed The planar light source module designs corresponding graphics on the circuit board, and then performs pattern etching on the copper film according to the graphics, such as a 5×5 LED array, and then tin-plates the surface of the copper film in the electrode...

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Abstract

The method comprises: coating a copper film on the surface of circuit board; according to a designed shape, etching the pattern on the copper film; coating a tin film on the surface of copper film connection wire used as electrode; coating metal film with high reflectance on the copper surface at non-connection area as reflection layer; bonding the LED chip on the tin surface of connection wire to get LED array; covering the LED array with the transparent protective cover to form the light source module; connecting the light source driving circuit to the light source to the integrated plane light source module.

Description

[technical field] [0001] The invention relates to the technical field of optoelectronic devices, in particular to a method for manufacturing a thin semiconductor lighting planar integrated light source module. [Background technique] [0002] Semiconductor lighting is a new type of high-efficiency solid light source made of light-emitting diode LED, namely Light Emitting Diode. It has many advantages such as long life, energy saving, economy, green environmental protection, rich colors, and miniaturization. It is gradually replacing traditional incandescent lighting. lamps and fluorescent lamps. As a lighting application, the development trend of LED is to develop high-power chips with high luminous efficiency, so that the luminous flux of a single chip can be as high as possible to meet the needs of general lighting. With the increase of the power of the chip, the current required for the chip to emit light is getting larger and larger, causing local heating to increase the...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K13/00F21S4/00F21V23/00F21V7/22F21Y101/02F21Y115/10
Inventor 孙卓
Owner 上海芯光科技有限公司