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Solid-state imaging device and electronic endoscope using the same

A solid-state imaging device and solid-state imaging technology, which are applied in the field of electronic endoscopy and can solve the problems of increasing the thickness of the solid-state imaging device and the like

Inactive Publication Date: 2007-08-08
FUJIFILM CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, in the case of the solid-state imaging device shown in FIG. 9, since the solid-state imaging element 104 is mounted in the package body 201, the thickness of the entire solid-state imaging device becomes substantially larger by t1

Method used

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  • Solid-state imaging device and electronic endoscope using the same
  • Solid-state imaging device and electronic endoscope using the same
  • Solid-state imaging device and electronic endoscope using the same

Examples

Experimental program
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no. 1 example

[0029] As shown in FIGS. 1A and 1B , a solid-state imaging device 2 according to the first embodiment has a substrate 3 , a solid-state imaging element 4 , and a frame 5 . It should be noted that letter symbol M in the drawings indicates a sealing resin portion.

[0030] For these components, the substrate 3 is formed of ceramics and has a substantially plate-like shape, and one end surface (right end surface in FIG. 1B ) of the substrate 3 is fixed by using a suitable adhesive (such as UV adhesive). Integrated with one end face (left end face in FIG. 1B ) of the solid-state imaging element 4 .

[0031] The solid-state imaging element 4 is constituted as a chip size package (CSP) type solid-state imaging element, and in terms of the overall configuration of the solid-state imaging element 4, as shown in FIG. 2A , the solid-state imaging element 4 has a solid-state imaging element substrate 4A and Cover glass 4B. Among these components, the solid-state imaging element substra...

no. 2 example

[0060] Fig. 8 shows an electronic endoscope of a direct observation type provided with a solid-state imaging device according to a second embodiment of the present invention. In this electronic endoscope, the solid-state imaging device 2 according to the first embodiment is installed inside the distal end portion 10 of the endoscope main body 1 .

[0061] The endoscope main body 1 is provided with: an observation channel 1A for observing an area to be observed through an objective lens 12, a prism 13, etc., from an observation window 11 opened on a distal end surface; and a treatment An instrument insertion channel 1B for performing various treatments by inserting an unillustrated therapeutic instrument through the forceps hole 14 from the forceps window 15 opened at the distal end face.

[0062] Therefore, according to this embodiment, the solid-state imaging device 2 can be made more compact when compared with the prior art solid-state imaging device shown in FIG. t1 is the...

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Abstract

A solid-state imaging device comprises: a solid-state imaging element comprising a solid-state imaging element body; a first substrate one end face of which is bonded to and integrated with one end face of a solid-state imaging element substrate of the solid-state imaging element, the first substrate comprising on its one surface an electrode for establishing electrical contact with a bonding wire led from a pad provided on one surface of the solid-state imaging element, a frame that seals the solid-state imaging element so as to surround outer peripheral surfaces of the solid-state imaging element substrate excluding its the one end face; and a sealing resin portion that covers a region extending from a portion including the electrode on the one surface of the first substrate to a portion including the pad on the one surface of the solid-state imaging element.

Description

technical field [0001] The present invention relates to a solid-state imaging device and an electronic endoscope using the same, and more particularly, to a solid-state imaging device such as a chip size package (CSP) type having a microlens integrated on a chip and a solid-state imaging device having the same An electronic endoscope with a solid-state imaging device. Background technique [0002] Various electronic type endoscopic devices, which are inserted into body cavities and achieve effects such as observing the inside of the body cavity, have been proposed and developed for biomedical use. In addition, various solid-state imaging elements including charge-coupled devices (CCDs) are used in these electronic type endoscopic devices. [0003] In the case of the direct observation type, for example, as shown in FIG. Inside are provided an objective lens 102 facing the observation window 101 on the distal end surface, and a prism 103 adjacent to the objective lens 102, ...

Claims

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Application Information

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IPC IPC(8): H01L27/148H01L23/00H01L23/10A61B1/04
CPCA61B1/05H01L2924/3025H01L27/14618A61B1/051H01L31/0203A61B1/018H01L2224/45144H01L2224/48091G02B23/2484H04N5/2252H04N5/2253H01L2224/49175H01L2224/05553H01L2924/16235H04N23/51H04N23/54H01L2924/00014H01L2924/00
Inventor 岛村均高桥一昭西田和弘
Owner FUJIFILM CORP
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