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High-speed measuring device for thickness of homogeneous material light penetrated thin plate

A technology for measuring devices and thin plates, applied in measuring devices, optical devices, optics, etc., to achieve the effect of low cost, simple structure and good stability

Inactive Publication Date: 2010-06-09
WUHAN UNIV OF TECH
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  • Claims
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Problems solved by technology

[0005]The above two methods have the following defects: 1. It is required that the reflectance of the upper and lower sides of the thin plate is high, the optical absorption coefficient α of the material is small and the scattering is small, otherwise the measurement error will be large
2. When the thin plate vibrates at low frequency, the measurement accuracy is extremely low, so the online high-speed measurement of the thickness of the thin plate cannot be performed

Method used

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  • High-speed measuring device for thickness of homogeneous material light penetrated thin plate
  • High-speed measuring device for thickness of homogeneous material light penetrated thin plate

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Embodiment Construction

[0025] Such as figure 1 Shown embodiment 1 of the present invention, it comprises controller 9 and laser device 1, beam expander 4, spatial filter 7, photoelectric sensor 8 that are positioned on the same optical path successively; The output terminal of photoelectric sensor 8 and the input of controller 9 end connection. The measured thin plate 5 is placed between the beam expander and the spatial filter, and the optical absorption coefficient of the light-transmitting thin plate is uniform.

[0026] In this embodiment, a He—Ne laser or a semiconductor laser with a power of mW level and a wavelength of λ=0.6328 μm is used. The diameter D of the center area of ​​the beam expander 4 is 14 mm; the length L of the spatial filter 7 is 100 mm, the aperture d is 10 mm, and the coaxiality is ≤0.3 mm (3%d).

[0027] The laser beam forms a relatively uniform plane wave through the beam expander 2, the diameter of the central area where the light intensity is basically the same D = 1...

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Abstract

This invention relates to one even transparent film board thickness high speed test device, which comprises controller and orderly laser, expending lens, space filter and photo electricity sensor in the same path. This invention applies the laser diffraction theory and technique into the transparent thickness high speed test technique to realize the materials optical absorptive parameter thicknessaccurate measurement to permit front diffraction without impact on film board vibration for online test.

Description

technical field [0001] The invention relates to a thickness measuring device, in particular to a measuring device for measuring the thickness of a light-transmitting thin plate, especially a thickness measuring device capable of online high-speed measurement of a light-transmitting thin plate of uniform material with a uniform optical absorption coefficient. Background technique [0002] The thickness measurement of light-transmitting thin plates is a basic item in geometric quantity measurement, and it is also a kind of engineering measurement item. A lot of research has been done on this in recent years, mainly focusing on non-contact measurement methods, especially laser methods. [0003] The article "Non-contact thickness measuring instrument" on page 29 of "Infrared" Impurities, Issue 12, 1996, proposed a non-contact laser measurement method for measuring the maximum value of the reflection intensity on the upper and lower sides of a transparent thin plate to determine...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B11/06G02B27/00
Inventor 卢红
Owner WUHAN UNIV OF TECH
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