Flip chip mounting method and flip chip mounting element

Abstract

A flip chip mounting method, which is applicable to the flip chip mounting of the next-generation LSI and is high in productivity and reliability, comprising the steps of supplying resin (13) containing solder powder and a convective additive (12) onto a wiring board (10) having a plurality of electrode terminals (11), then bringing a semiconductor chip (20) having a plurality of connection terminals (21) into contact with the surface of resin (13), and heating the wiring board (10) to a solder powder melting temperature under this condition. The heating is conducted at a temperature higher than the boiling temperature of the convective additive (12) to allow the boiled convective additive (12) to flow throughout the resin (13). During this heating process, melted solder powder is self-assembled between the electrode terminal (11) of the wiring board (10) and the connection terminal (21) of the semiconductor chip (20) to thereby electrically connect the electrode terminal (11) with the connection terminal (21). Finally, the resin (13) is cured to fix the semiconductor chip (20) to the wiring board (10).

Description

technical field [0001] The present invention relates to a flip chip mounting method for mounting a semiconductor chip on a wiring board and a flip chip mounted body, and more particularly to high-productivity flip chip mounting that can also cope with narrower semiconductor chips Method and flip-chip mounting body. Background technique [0002] In recent years, along with the high density and high integration of semiconductor integrated circuits (LSI) used in electronic equipment, the number of pins (peen) and the narrowing of the pitch of the electrode terminals of the LSI sheet are also rapidly progressing. These LSI chips are mounted on a wiring substrate, and flip-chip mounting is widely used in order to reduce wiring delays. Furthermore, in this flip-chip mounting, generally, solder bumps are formed on the electrode terminals of the LSI chip, and electrodes formed on the wiring board are collectively bonded via the solder bumps. [0003] However, in order to mount a n...

AI Technical Summary

Problems solved by technology

[0015] However, in flip-chip mounting using the above-mentioned anisotropic conductive material, electrical conduction between electrodes is obtained by mechanical contact via conductive particles, but it is difficult to obtain a stable conduction state in this way.

In addition, the conductive particles sandwiched in the counter electrode are held by the cohesive force generated by the thermosetting of the resin, so it is necessary to make the characteristics such as elastic modulus and thermal expansion coefficient of the thermosetting resin or the particle size distribution of the conductive particles consistent, Therefore, there is a problem that it is difficult to control the mounting process.

That is, in order to apply flip-chip mounting using anisotropic conductive materials to next-generation LSI chips with more than 5,000 connection terminals, there are still many problems to be solved in terms of productivity and reliability.

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