High-yield culture technique of corn standard mode

A new technology, corn technology, which is applied in the field of crop cultivation, can solve the problems of lack of standardized model cultivation technology and low yield of corn planting, and achieve the effect that is beneficial to the whole seedlings and strong seedlings, to the growth of corn, and to the scientific and reasonable planting density

Inactive Publication Date: 2007-09-12
王文柱
View PDF0 Cites 19 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the deficiencies of the prior art and solve the problems of low corn planting yield and lack of standardized model cultivation technology, the present invention provides a novel cultivation technology, scientific and reasonable planting density, high natural pollination rate, and the advantages of seed selection, planting and fertilization management, disease an

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] The test site is Siying Township, Botou City, Hebei Province, with an area of ​​300 mu, and the time is two years in 2005 and 2006. Specifically:

[0023] a. Select excellent species: select Zhengdan hybrid corn seeds, the seed quality reaches the national first-class corn seed standard, the seed germination rate is 99%, and the seeds are sun-dried for 2 days before sowing.

[0024] b. Seed coating: Use 50 mL of Yufengshou coating agent to coat 6 kg of seeds for coating corn seeds.

[0025] c. Mode sowing: The sowing depth is 3-4 cm. Use a special precision seeder to press 2 seeds per hole to concentrate double seedlings, adventitious seedlings, and large and small rows. The large row is 70 cm, the small row is 53 cm, and the plant spacing is 45. cm, with an average of 5100 seedlings and 2600 holes per mu.

[0026] d. Chemical weeding: use 80 ml of 50% acetochlor EC mixed with 50 kg of water to spray the ground for weeding after corn seeding and before emergence.

[...

Embodiment 2

[0032] The experimental site is Dazhaotun Village, Siying Township, Botou City, Hebei Province, with an area of ​​100 mu, and 20 mu of the comparison field was planted and managed according to the usual cultivation techniques, and the time was 3 years from 2004 to 2006. Specifically:

[0033] a. Select excellent species: select 50 mu of Jundan corn and 50 mu of Zhengdan corn, the seed quality reaches the national first-class corn seed standard, the seed germination rate is 98.6%, and the seeds are sun-dried for 2 days before sowing.

[0034] b. Seed coating: Use 50 mL of Yufengshou coating agent to coat 6 kg of seeds for coating corn seeds.

[0035] c. Mode sowing: The sowing depth is 3-4 cm. Use a special precision seeder to press 2 seeds per hole to concentrate double seedlings, adventitious seedlings, and 40 acres of equal row mode. The row spacing is 62 cm and the plant spacing is 45 cm. The number of seedlings per acre is 4200, 2200 holes; the pattern of large and small ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention relates to crop planting technology, and is especially standard high yield corn planting mode technology. The standard high yield corn planting mode technology includes sorting improved corn variety, coating seed, mode seeding, chemical weeding, chemical plant controlling, comprehensive disease and pest prevention and controlling, fertilizing based on certain recipe and timely harvesting. The mode seeding with two grains of seed and in certain line spacing and plant spacing is adopted. The present invention has novel corn planting, reasonable planting density and standardized management, and is suitable for summer corn planting.

Description

technical field [0001] The invention belongs to a corn patterned cultivation technology in the technical field of crop cultivation. Background technique [0002] With the increasing development of agricultural modernization and the rapid advancement of science and technology, the requirements for the field crop corn planting technology are getting higher and higher, and the majority of farmers are in urgent need of new high-quality and high-yield cultivation technologies. In the known technology, the existing corn cultivation technology mainly adopts single hole and single plant colonization after sowing seedlings, usually 3 to 4 seeds to protect 1 seedling, wasting seeds, the spacing between plants and rows is uncertain, water and fertilizer management, pest control and so on are lacking. The model cultivation technology has a small planting density and cannot make full use of the land area. It also makes the crops have poor lodging resistance and low natural pollination ra...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): A01G1/00A01C1/00A01M21/04A01M1/20A01G7/06A01C21/00
Inventor 王文柱
Owner 王文柱
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap