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Automation hot- press machine

A technology of hot press and hot press, applied in the field of hot press, can solve problems such as inapplicability, instability, and inability to use one machine for multiple purposes, and achieve the effects of simplifying operations, reducing costs, and improving equipment utilization.

Inactive Publication Date: 2007-09-19
GARMIN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the setting of the camera device needs to match the characteristics of the material, so it cannot be used for multiple purposes (that is, applied to multiple processes); for example, in the ACF process, the TCP IC is mainly overlapped on the LCD panel, The LCD panel is bonded to the TCP IC by hot pressing. The LCD panel is made of a transparent material, so the circuit images of the two can be captured from the bottom of the carrier board. However, in the HSC process, when the HSC and the TCP IC are to be bonded, due to These are all opaque materials, so they are not suitable for the method of taking images from the bottom in the ACF process. It is necessary to design the process equipment for taking images from the top for the HSC process.
In addition, the adjustment is still carried out manually, so there will still be artificial instability in the thermocompression bonding process

Method used

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Examples

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example 1

[0085] When performing the ACF process, the LCD panel is thermocompression bonded to the TCP IC using the automated thermocompressor according to the present invention. Firstly, the LCD panel is placed on the first carrying platform, and the TCP IC is placed on the second carrying platform, and the outer pins of the TCP IC face down and overlap the electrode connection end of the LCD panel. Then, the LCD panel and the TCP IC can be adsorbed and fixed on the carrying platform by using the suction airflow generated in the air holes on the carrying platform. Then, the two image-capturing devices respectively obtain the images on the left and right sides of the intersection from below through the corresponding mirror groups, and form two image signals accordingly. After the image signal is processed and analyzed by the image processing module, a correction signal can be obtained. The alignment device adjusts the position of the first carrying platform according to the correction ...

example 2

[0087] When performing the HSC process, the HSC is thermocompressively bonded to the TCP IC using the automated thermocompressor according to the present invention. All the procedures are roughly the same as above, except that when taking images, the two image taking devices directly obtain the images on the left and right sides of the overlap from above, and form two image signals based on them, so as to carry out alignment adjustment and heat pressing and so on.

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Abstract

The invention relates to an automatic hot press machine for automatically performing the engagement manufacturing process of a first material part and a second material part. The automatic hot press machine comprises a bearing assembly with a first bearing platform and a second bearing platform; an adjusting unit with an assitant block, a set of images capturing devices, a image processing and a contraposition device; and a hotpressing assembly with a hotpressing device and a shifter. The first material part and second material part are loaded and fixed by bearing assembly. The adjusting unit adjusts the first bearing platform by analysising the images of overlaping coupling areas of the first material part and second material part to make the coupling areas of the first material part and second material part correspond with each other. The bearing assembly moves under the hotpressing device to perforn hotpressing. After hotpressing, the bearing assembly moves to the original position. The invention can simplify the job operation, increase the utility factor, reliability and good rate and reduce the cost.

Description

technical field [0001] The invention relates to a heat press machine, in particular to an automatic heat press machine. Background technique [0002] Traditionally, the joining of liquid crystal display (liquid crystal display; LCD) panel and its controller / driver integrated circuit (controller / driver IC) is accomplished by thermal transfer (heal seal) bonding, for example: Hot pressing process of heat-pressed conductive zebra paper (Heat Seal Connector; HSC). However, as the distance between lines shrinks day by day, bonding methods such as tape automated bounding (TAB) and chip on film (COF) have been developed. These two bonding methods both use anisotropic conductive film (ACF) as the interface. [0003] In the thermocompression bonding process, the heat press machine can be said to be the main factor affecting product yield, reliability and productivity. Therefore, many panel manufacturers / processors are vigorously improving the heat press machine in order to make the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C65/02B29C65/78B29C65/00
Inventor 戴士杰黄荣进蓝文雄
Owner GARMIN
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