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High power LED lighting lamp model set

An LED lighting, high-power technology, applied in lighting devices, lighting and heating equipment, components of lighting devices, etc., can solve the problems of reducing heat dissipation efficiency and effect, poor universality of metal plates, and difficulty in coating processing, etc. Simple and convenient processing, simple manufacturing process, good heat dissipation effect

Inactive Publication Date: 2010-05-19
诸建平
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because the protrusion and the metal plate are integrated structures, copper and aluminum, which have better heat dissipation and heat conduction effects, if the metal plate adopts an aluminum structure, it is difficult to perform coating processing in the groove of the protrusion; Copper structure, the material cost is too high, uneconomical, unacceptable by the market
Moreover, the versatility of the metal plate is also poor. The number and position of the protrusions have been determined, and it can only be matched with the corresponding insulator, and the number and position of the protrusions cannot be adjusted according to product needs.
In addition, due to the combination of the metal plate and the insulating matrix, the joint surface of the metal plate cannot contact the air for heat exchange, and the heat can only be dissipated through the other side of the metal plate, which reduces the efficiency and effect of heat dissipation

Method used

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  • High power LED lighting lamp model set
  • High power LED lighting lamp model set
  • High power LED lighting lamp model set

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Such as figure 1 As shown, the heat dissipation base plate 1 of the present embodiment 1 is a disc-shaped structure, and the circuit board 4 is installed and fixed on the heat dissipation base plate 1, and the size and shape of the two are the same. The lens 5 is installed on the circuit board 4, and the brightness and angle of the light source can be adjusted as required.

[0048] Such as figure 2 As shown, in Embodiment 1, the heat dissipation base plate 1 is provided with a socket 11 on the other side of the heat dissipation fin for fixing the base 2. The base 2 can be fixed in part or all of the sockets 11 as required. When fixing it, you can first apply a layer of thermally conductive resin or thermally conductive glue on the surface, so that it can be firmly fixed between the base and the socket, and the heat between the two can be effectively Conduction.

[0049] The base 2 is made of red copper. Of course, the base 2 can also be made of other metals, alloys or cer...

Embodiment 2

[0056] Such as Figure 4 As shown, Embodiment 2 is provided with multiple lenses on the circuit board 4, which is different from the single lens structure in Embodiment 1. Wherein, the heat dissipation base plate 2 has a square structure, and heat dissipation fins 14 are arranged on the back of the heat dissipation base plate 2 and are distributed horizontally and horizontally. Other structures such as needle-shaped, emissive-shaped, etc. may also be adopted. The heat sink 14 has a structure with a wide bottom and a narrow end, which can effectively improve the heat transfer and heat dissipation effects of the heat sink 14.

[0057] Such as Figure 5 , 6 As shown, a slot 12 for heat dissipation is provided around the jack 11. It is particularly pointed out that the slot 12 is not made directly on the edge of the jack 11, but is separated from the jack 11 by a certain distance to ensure the base 2 can be stably installed in the jack 11, and the base 2 and the heat dissipation base...

Embodiment 3

[0060] in Figure 7 It can be seen that there are nine jacks 11 in three rows and three columns in the heat dissipation base plate 1, but there are only four in the base 2, which correspond to the four corner jacks 11 in the matrix, and the corresponding ones are on the circuit board. 4 is also provided with four openings 41, so after the heat dissipation bottom plate 1, the base 2 and the circuit board 4 are installed, a part of the jack 11 will still be vacant.

[0061] in Picture 8 In the middle, the hole 11 that is vacant in the heat dissipation base plate 1 can be seen, but it is hidden by the circuit board 4 and cannot be noticed from the appearance. Therefore, the jack 11 of the heat dissipation base plate 1 has a function similar to a universal board, and the installation position and quantity can be selected according to the needs, without changing the heat dissipation base plate 1. In this embodiment, a single lens 5 is fixed on the circuit board 4, or a lens 5 can be ...

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Abstract

A LED illuminating module comprises the heat radiation bottom plate, base plate, crystalline plate, circuit plate and lens, with plug holes on the heat radiation bottom plate, the said base fixed in part of whole of the plug hole, through hole of the circuit board corresponding to the said base, circuit board fixed on the heat radiation bottom plate and the crystalline fixed on the reflective bowlof the base. It applies to several big power LED, providing good heat radiation effect, simple process, simplified batch production, low in cost, and easy for marketing.

Description

[0001] Involved in the field [0002] The invention relates to a lighting device, in particular to an LED lighting module. Background technique [0003] At present, most of the LEDs (Light Emitting Diodes) on the market adopt single-core technology, or encapsulate many low-power chips on metal substrates such as aluminum substrates. Although the single-core technology can better solve the heat dissipation problem, it is affected by the luminous efficiency of the chip, and the brightness is not high; although the multi-chip technology can greatly improve the luminous efficiency, the distributed current of each chip is different. When connected in series, although the driving current is stable, if one of the chips burns out, it will cause the whole circuit to be disconnected; when the LED chips are connected in parallel, it is difficult to control the voltage, which makes the LED bear different currents and easy to attenuate. [0004] In the patent No. 02802732.9 "light emitting devic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21V19/00F21V23/00F21V29/00F21V17/00F21Y101/02F21V29/70F21V29/85F21Y105/16F21Y115/10
Inventor 诸建平
Owner 诸建平