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Pulse reverse electrolysis of acidic copper electroplating solutions

A copper electroplating solution and electroplating solution technology, applied in jewelry and other fields, can solve problems such as poor metal distribution, large differences, and small thickness

Inactive Publication Date: 2007-09-26
MACDERMID INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] A disadvantage of the prior art for producing cylinders is that in order to achieve the desired thickness over the entire length of the printing cylinder, the thickness of the copper plating in the center of the cylinder must be minimal
It is surprising that the current density range is so different from that applied during PCB plating or rack plating applications, and is also surprised that the metal distribution is worse due to the increased current density in conventional plating applications

Method used

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  • Pulse reverse electrolysis of acidic copper electroplating solutions
  • Pulse reverse electrolysis of acidic copper electroplating solutions
  • Pulse reverse electrolysis of acidic copper electroplating solutions

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Embodiment 1 - prior art

[0035] The electroplating bath composition that adopts comprises following:

[0036] Copper Sulphate Pentahydrate 220g / l

[0037] Sulfuric acid 35g / l

[0038] Chloride None

[0039] Special additives Yes

[0040] Electroplating method: DC 25A / dm 2

[0041] Plating time 1 hour

[0042] The copper plating had a bright appearance and no pits, irregular pellets, or other defects were observed on the print cylinder surface.

Embodiment 2

[0044] The electroplating bath composition that adopts comprises following:

[0045] Copper Sulphate Pentahydrate 150g / l

[0046] Sulfuric acid 105g / l

[0047] Chloride 85mg / l

[0048] Polyethylene glycol (MW 12,000) 400mg / l

[0049] Bis-(propane-3-sulfonic acid) disulfide,

[0050] Disodium salt 35mg / l

[0051] Special Additives None

[0052] Electroplating method: average pulse 15A / dm 2

[0053] 38ms forward

[0054] 2ms reverse 2 times forward current

[0055] Plating time 1 hour

[0056] The copper plating had a bright appearance and no pits, irregular pellets, or other defects were observed on the print cylinder surface.

Embodiment 3

[0058] The electroplating bath composition that adopts comprises following:

[0059] Copper Sulphate Pentahydrate 150g / l

[0060] Sulfuric acid 105g / l

[0061] Chloride 85mg / l

[0062] Ethylene Oxide / Propylene Oxide

[0063] Copolymer (MW 12,000) 400mg / l

[0064] Mercaptopropanesulfonic acid,

[0065] Sodium salt 25mg / l

[0066] Special additives Yes

[0067] Electroplating method: average pulse 15A / dm 2

[0068] 20ms forward

[0069] 1ms reverse 2 times forward current

[0070] Plating time 1 hour

[0071] The copper plating had a bright appearance and no pits, irregular pellets, or other defects were observed on the print cylinder surface.

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Abstract

The present invention provides pulse reverse electrolysis of acid copper solutions is used for applying copper to printing cylinders, especially gravure printing cylinders. The plating composition generally comprising copper ions, counter ions, chloride ions, a polyalkylene glycol, and a bath-soluble divalent sulfur compound. The benefits include an improved thickness distribution of the copper electrodeposited on the plated article, reduced metal waste, reduced plating times and increased production capacity.

Description

technical field [0001] The invention relates to a method of manufacturing an intaglio printing cylinder. Background technique [0002] Electroplating copper from acidic solutions is well known and has many industrial applications. In most applications, the item to be plated is suspended in an electrolyte solution, a technique commonly known as rack plating. Rack plating is a well known process, examples of which can be found in U.S. Patent Nos. 3,939,056 to Fueki et al.; way incorporated into this article. [0003] Another well-known application in industry is copper-coated steel and aluminum cylinders for printing applications such as gravure printing, where steel or aluminum is used to provide an inexpensive and robust substrate for an engravable copper coating. Gravure printing is a method using the intaglio printing method in which the pattern to be printed consists of etched or engraved recesses, usually of varying depth. Slightly tacky solvent ink was applied to th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D7/00C25D5/18C25D3/38C25D7/04
CPCC25D5/18C25D3/38C25D5/627
Inventor 罗德里克·D·赫德曼特雷弗·皮尔逊欧内斯特·朗艾伦·加德纳
Owner MACDERMID INC