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Thermal control of dielectric components in a plasma discharge device

A technology for plasma and discharge devices, used in semiconductor/solid state device manufacturing, discharge tubes, electrical components, etc., to achieve the effect of improving safe and reliable operation and reducing hot spots

Inactive Publication Date: 2007-10-17
ADVANCED ENERGY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Other issues have been addressed, namely temperature control in dielectric plasma chambers using cooled or uncooled dielectric shields or thin-walled metal cooling structures located within the dielectric confinement chamber

Method used

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  • Thermal control of dielectric components in a plasma discharge device
  • Thermal control of dielectric components in a plasma discharge device
  • Thermal control of dielectric components in a plasma discharge device

Examples

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Embodiment Construction

[0015] Fig. 1 shows a plasma source arrangement according to one embodiment of the present invention. The plasma source 100 includes a cylindrical discharge tube 102 in which plasma is contained. The discharge tube 102 is generally constructed of a structural dielectric such as quartz, alumina, aluminum nitride, or other structure appropriate to the chemistry of the discharge environment within the tube. The discharge tube 102 is open at both ends 104 to allow gas entry and exit, for example in an in-line gas processing application. Alternatively, the plasma tube can be configured as a sealed vacuum chamber with metered inlets and outlets for supply and process gases. Other structures that may typically be included in plasma processing apparatus, such as vacuum pumping manifolds, gas delivery connections or manifolds, plasma ignition electrodes, or other devices, are not shown; and are not shown for workpiece mounting, transfer or electrically biased bodies.

[0016] A heli...

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Abstract

A plasma discharge device is provided having features for enhanced thermal management and protection of dielectric materials in the device. The invention generally comprises a plasma confinement chamber constructed at least in part of dielectric materials, with a cooling instrument disposed in contact with the outer dielectric surfaces of the chamber for substantially uniform heat extraction. The cooling instrument may be embedded within an encapsulating material that enhances the uniformity of heat extraction from a dielectric plasma chamber. By improving the uniformity of heat extraction from the dielectric chamber of a plasma discharge device, the invention permits reliable operation of a plasma discharge device at significantly improved power levels.

Description

technical field [0001] The present invention relates generally to plasma discharge devices and, more particularly, to thermal control and protection of dielectric materials in plasma discharge devices. Background technique [0002] A persistent challenge in the engineering of plasma discharge devices is the control and removal of the heat generated by the plasma. The ability of materials exposed to the plasma to withstand the thermal environment of the discharge often significantly limits the performance, range, reliability, or other operating characteristics of the plasma device. The problem of thermal management is particularly difficult in that, especially for structural purposes, devices have dielectric materials adjacent to the plasma due to the poor thermal conductivity of most dielectrics. Although certain dielectric materials such as ceramics can tolerate substantially increased temperatures, hot spots due to non-uniform cooling can cause internal stresses in the di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/306C23C16/00
CPCH01J37/321H01J37/32522C23C16/00
Inventor 贾斯廷·莫克史蒂夫·狄龙胡安·何塞·冈萨雷斯安德鲁·沙巴林
Owner ADVANCED ENERGY IND INC
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