Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Substrate carrier capable of removing electrostatics

A carrier and substrate technology, applied in the direction of static electricity, circuits, electrical components, etc., can solve problems such as process errors, achieve the effect of improving yield and improving static interference

Inactive Publication Date: 2007-11-14
CHUNGHWA PICTURE TUBES LTD
View PDF0 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, since these contact pads 140 will rub against the glass substrate 150, electrostatic charges will start to accumulate between the glass substrate 150 and the contact pads 140. The aforementioned electrostatic effect will occur, therefore, the regions 160, 170 shown in Figure 1 will produce the aforementioned electrostatic effect
The electrostatic effect will change the electric field around the regions 160 and 170, so that when the glass substrate 150 undergoes various processes, unnecessary process errors will be generated due to the instability of the electric field

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate carrier capable of removing electrostatics
  • Substrate carrier capable of removing electrostatics
  • Substrate carrier capable of removing electrostatics

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] Please refer to FIG. 2 , which is a schematic diagram of a robot forklift 200 of the present invention. As shown in FIG. 2 , the robot arm 200 also includes support modules 210 , 220 and a connection module 230 . The connection module 230 is connected to the robot body, and the support modules 210, 220 are connected to the connection module 230 to provide a support force for the support modules 210, 220 through the connection force between the support modules 210, 220 and the connection module 230. . Therefore, the supporting modules 210 and 220 can be used to carry the glass substrate 250 to transport the glass substrate 250 to different machines.

[0021] Same as the robot arm 100 , the support modules 210 and 220 of the robot arm 200 of the present invention are also provided with a plurality of contact pads 240 . When the support modules 210, 220 transport the glass substrate 250, these contact pads 240 will provide multiple contact surfaces of the glass substrate...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention is a carrier for carrying a substrate, comprising: a support module having at least a contact region contacting with the substrate to support a support force to carry the substrate; and a conductive medium, connected to the contact region and a voltage reference to eliminate the static between the contact region and the substrate.

Description

technical field [0001] The invention relates to a substrate carrier, in particular to a substrate carrier capable of eliminating static electricity. Background technique [0002] In the semiconductor process, each substrate (or wafer) will go through several different processes to produce various electronic products. For example, in the manufacture of liquid crystal displays (LCDs), glass substrates also need to go through complicated processes such as exposure, development, deposition, etc., and these complicated process steps must be completed by different machines, so In the process of making the glass substrate, it must be moved to different machines for different process steps according to the process being performed. [0003] However, placing the glass substrate in the clean room will cause poor charging, especially during the transfer process, whether the glass substrate is placed in a cassette, on a moving transport device (such as a vacuum robot), or Even in the w...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/683H05F3/00
Inventor 刘懿承王信雄黄铭岗
Owner CHUNGHWA PICTURE TUBES LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com