Substrate carrier capable of removing electrostatics

Abstract

The invention is a carrier for carrying a substrate, comprising: a support module having at least a contact region contacting with the substrate to support a support force to carry the substrate; and a conductive medium, connected to the contact region and a voltage reference to eliminate the static between the contact region and the substrate.

Description

technical field [0001] The invention relates to a substrate carrier, in particular to a substrate carrier capable of eliminating static electricity. Background technique [0002] In the semiconductor process, each substrate (or wafer) will go through several different processes to produce various electronic products. For example, in the manufacture of liquid crystal displays (LCDs), glass substrates also need to go through complicated processes such as exposure, development, deposition, etc., and these complicated process steps must be completed by different machines, so In the process of making the glass substrate, it must be moved to different machines for different process steps according to the process being performed. [0003] However, placing the glass substrate in the clean room will cause poor charging, especially during the transfer process, whether the glass substrate is placed in a cassette, on a moving transport device (such as a vacuum robot), or Even in the w...

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Problems solved by technology

[0007] However, since these contact pads 140 will rub against the glass substrate 150, electrostatic charges will start to accumulate between the glass substrate 150 and the contact pads 140. The aforementioned electrostatic effect will occur, therefore, the regions 160, 170 shown in Figure 1

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