Optimized wire bonding of an integrated modulator and laser diode on a mount

A technology for optical semiconductor components and mounting substrates, which is applied in semiconductor devices, semiconductor lasers, semiconductor/solid-state device components, etc., and can solve problems such as difficulty in obtaining output waveform quality
CN101071808AActive Publication Date: 2007-11-14NIPPON LUMENTUM CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
NIPPON LUMENTUM CO LTD
Publication Date
2007-11-14

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Abstract

An optical transmission module of the invention uses a semiconductor chip (22) forming an optical modulator integrated laser on a semi-insulating semiconductor board (23). An input transfer line (27) and an anode electrode of an optical modulator element (21) are connected by a first bonding wire (31). The anode electrode of the optical modulator element (21) and one of the ends of a terminal resistor element (24) are connected by a second bonding wire (32). A cathode electrode of the optical modulator element (21) and the other end of the terminal resistor element (24) are connected by a third bonding wire (33). The cathode electrode of the optical modulator element (21) and a ground electrode (25) are connected by a fourth bonding wire (34). A joint portion between the first bonding wire (31) and the input transfer line (27) is arranged on an opposite side to a joint portion between the fourth bonding wire (34) and the ground electrode (25) while interposing the semiconductor chip (22) between them.
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Description

technical field

[0001] The present invention relates to an optical transmission module for optical communication, and more particularly to an optical transmission module used in a transmission unit of an optical wireless transceiver having a high-speed transmission rate (for example, 10 Gbit / s). Background technique

[0002] An optical transmission module using a semiconductor laser is one of the key components of a wireless transceiver for optical fiber transmission. With the spread of broadband networks in recent years, the speed of optical transmission modules is being sought, and optical transmission modules with a bit rate of 10 Gbit / s are widely used. As an optical transmission module suitable for the above-mentioned application, it is strongly required to realize good transmission waveform quality while being small and low-cost.

[0003] Conventionally, Japanese Patent Laid-Open No. 2001-257412 (corresponding to U.S. Patent No. 6,823,145 ) and Japanese Patent Laid-Op...

Claims

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