Epoxy resin, epoxy resin composition, and cured object obtained therefrom

A technology of epoxy resin and composition, applied in the direction of electrical components, printed circuits, etc., to achieve the effect of excellent toughness

Inactive Publication Date: 2007-12-05
NIPPON KAYAKU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, when applying a magnetic field or the like to the entire epoxy resin composition, there is a problem that a large-scale device is required.

Method used

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  • Epoxy resin, epoxy resin composition, and cured object obtained therefrom
  • Epoxy resin, epoxy resin composition, and cured object obtained therefrom
  • Epoxy resin, epoxy resin composition, and cured object obtained therefrom

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] In the flask equipped with a thermometer, a cooling pipe, a split pipe, and a stirrer, purging with nitrogen, simultaneously with respect to the phenolic compound represented by the above formula (2) (trade name: P, P'-BPF Honshu Chemical Co., Ltd. ) 100 parts, add 370 parts of epichlorohydrin and 26 parts of methanol, heat up to 65-70 ° C under stirring, after completely dissolving, under reflux conditions, divide 40.4 parts by weight of flaky sodium hydroxide into 100 parts and add separately . Then, a post-reaction was performed at 70° C. for 1 hour. Next, 150 parts of water was added, and water washing was performed twice. Excess epichlorohydrin and the like were removed from the oil layer under heating and reduced pressure. 312 parts of methyl isobutyl ketone was added and dissolved in the remaining components, and 10 parts of 30% sodium hydroxide aqueous solution was added at 70 degreeC, and it reacted for 1 hour. After the reaction, it was washed with water th...

Embodiment 2

[0059] In embodiment 2, with respect to the epoxy resin (B1) 8.9 parts that obtain in embodiment 1, use alkylphenol type resin XLC-3L (manufactured by Mitsui Chemicals Co., Ltd., softening point 71 ℃, hydroxyl equivalent 174g / eq) 3.5 parts, 0.1 part of 2PHZ-PW (manufactured by Shikoku Chemicals Co., Ltd.) as a curing accelerator, and 5.4 parts of cyclopentanone as a solvent were uniformly mixed to prepare a varnish.

[0060] The above-mentioned varnish was applied onto a PET film with an applicator to a thickness of 20 μm after drying, heated at 140° C. for 1 hour, the solvent was removed and cured, and the PET film was removed. As a result, a colorless and transparent flexible film-like cured product was obtained. Even when the film-like cured product was bent and wrinkled, no cracks occurred. As a result of observing this thin film with a polarizing microscope, it was confirmed that it exhibited optical anisotropy.

Embodiment 3

[0062]In the flask equipped with a thermometer, a cooling pipe, a split pipe, and a stirrer, purging with nitrogen gas, simultaneously with respect to the phenolic compound represented by the above formula (2) (trade name: P, P'-BPF manufactured by Honshu Chemical Co., Ltd. ) 100 parts, add 370 parts of epichlorohydrin and 26 parts of methanol, heat up to 65-75 ° C under stirring, after completely dissolving, under reflux conditions, divide 41.6 parts by weight of flaky sodium hydroxide into 100 parts and add separately. Then, a post-reaction was performed at 70° C. for 1 hour. Next, 150 parts of water was added, and water washing was performed twice. Excess epichlorohydrin and the like were removed from the oil layer under heating and reduced pressure. Methyl isobutyl ketone was added to the remaining components to dissolve, and 10 parts of 30% sodium hydroxide aqueous solution was added at 70 degreeC, and it reacted for 1 hour. After the reaction, it was washed with water ...

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Abstract

An epoxy resin which is easy to produce and readily realizes a state in which the molecules are oriented. The epoxy resin gives a cured object which has optical anisotropy and is excellent in toughness and thermal conductivity. The epoxy resin is represented by the following formula (1) (wherein n, which is an average value, is 0.1-20). The epoxy resin can be obtained by subjecting a product of the epoxidization of 4,4'-bisphenol F to chain extension with 4,4'-biphenol.

Description

technical field [0001] The invention relates to an epoxy resin with high molecular orientation, especially an epoxy resin with excellent toughness and thermal conductivity characteristics in its cured product, an epoxy resin composition and its cured product. Background technique [0002] It is well known that an epoxy resin composition forms a random network structure through a crosslinking reaction, and becomes a cured product excellent in heat resistance, water resistance, insulation, and the like. Furthermore, in recent years, attempts have been made to improve the characteristics of cured products by orienting the epoxy resin composition in a specific direction by applying physical force from the outside when curing the epoxy resin composition. For example, in Patent Document 1, there is a record that an epoxy resin having a mesogenic group in the molecule shows high thermal conductivity in its cured product; The group of epoxy resin can be cured after applying a magne...

Claims

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Application Information

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IPC IPC(8): C08G59/06
CPCH05K1/0326C08L63/00C08G59/245C08G59/06C08G59/18
Inventor 赤塚泰昌押见克彦中西政隆茂木繁
Owner NIPPON KAYAKU CO LTD
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