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Exposure apparatus, exposure method, and device production method

A technology of exposure device and exposure method, which is applied in semiconductor/solid-state device manufacturing, photolithography exposure device, microlithography exposure equipment, etc. Problems such as thermal deformation of the bottom carrier

Inactive Publication Date: 2007-12-19
NIKON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, there may be thermal deformation of the substrate, substrate stage, etc. due to the heat of vaporization generated by the leaked liquid; or changes in the placement environment (humidity, cleanliness, etc.) Deterioration of exposure accuracy, such as pattern superposition accuracy on the bottom; or deterioration of various measurement accuracy using interferometers, etc.
In addition, when the substrate with residual (adhered) liquid is carried out from the substrate stage, the liquid may also adhere to the transfer system that holds the wetted substrate, and the range of damage may expand.
Furthermore, as the movement speed of the substrate (substrate stage PST) increases, the area covered by the liquid may expand, and at the same time, the entire exposure apparatus may also expand.

Method used

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  • Exposure apparatus, exposure method, and device production method
  • Exposure apparatus, exposure method, and device production method
  • Exposure apparatus, exposure method, and device production method

Examples

Experimental program
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no. 1 approach

[0060] FIG. 1 is a schematic configuration diagram showing an exposure apparatus according to a first embodiment. In FIG. 1 , the exposure apparatus EX includes: a mask stage MST for holding and moving a mask M; a substrate stage PST for holding and moving a substrate P; The mask M held on the mask stage MST is illuminated; the projection optical system PL projects the pattern image of the mask M illuminated by the exposure light EL onto the substrate P held on the substrate stage PST; The device CONT controls the overall operation of the exposure device EX.

[0061] The exposure apparatus EX of the present embodiment is a liquid immersion exposure apparatus to which a liquid immersion method is applied in order to actually shorten the exposure wavelength to increase the resolution, and to actually deepen the depth of focus. Exposure apparatus EX includes liquid immersion mechanism 1 for filling optical path space K1 of exposure light EL near the image plane of projection opt...

no. 2 approach

[0142] Next, a second embodiment will be described with reference to FIGS. 9 to 12 . In the following description, the same or equivalent components as those of the above-mentioned first embodiment are denoted by the same reference numerals, and their descriptions are simplified or omitted.

[0143] 9 is a partial sectional view showing a schematic perspective view of the vicinity of the nozzle member 70 according to the second embodiment, FIG. 10 is a perspective view showing the nozzle member 70 seen from the lower side, FIG. 11 is a side sectional view parallel to the XZ plane, and FIG. is a side sectional view parallel to the YZ plane.

[0144] An opening 74 through which the exposure light EL passes is formed in the central portion of the bottom plate portion 70D of the nozzle member 70 . The opening 74 has a shape corresponding to the projected area AR, and is formed in a slit shape (approximately rectangular) whose longitudinal direction is the X-axis direction (scanni...

no. 3 approach

[0169] Next, a third embodiment will be described with reference to FIGS. 14 to 17 . 14 is a partial sectional view showing a schematic perspective view of the vicinity of the nozzle member 70 according to the third embodiment, FIG. 15 is a perspective view showing the nozzle member 70 seen from below, FIG. 16 is a side sectional view parallel to the XZ plane, and FIG. 17 is a side sectional view parallel to the YZ plane.

[0170] An opening 74 through which the exposure light EL passes is formed in the central portion of the bottom plate portion 70D of the nozzle member 70 . The opening 74 has a shape corresponding to the projected area AR, and is formed in the shape of a slit whose longitudinal direction is the X-axis, similarly to the first embodiment described above. A first land surface 75 is provided around the opening 74 on the lower surface of the nozzle member 70 . The first land surface 75 is provided so as to face the surface of the substrate P and surround the op...

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Abstract

An exposure apparatus has a first land surface (75) facing a surface of a substrate and surrounding a light path space (K1) for exposure light; a second land surface (76) facing the surface of the substrate and provided outside, in a predetermined direction, the first land surface (75); and a recovery opening (22) for recovering liquid to be placed in the light path space (K1). The first land surface (75) is provided in substantially parallel to the surface of the substrate. The second land surface (76) is provided at a position further from the surface of the substrate than the position of the first land surface (75). The recovery opening (22) is formed outside first land surface (75) and the second land surface (76). Even when the substrate is exposed while being moved, the light path space for the exposure light can be filled with the liquid to a desired state.

Description

technical field [0001] The present invention relates to an exposure device, an exposure method, and a device manufacturing method for exposing a substrate by means of a liquid. Background technique [0002] In photolithography, which is one of the manufacturing steps of microdevices such as semiconductor devices and liquid crystal display devices, an exposure device that projects a pattern formed on a mask onto a photosensitive substrate is used. This exposure apparatus has a mask stage capable of holding and moving a mask, and a substrate stage capable of holding and moving a substrate. A pattern is projected on a substrate. In the manufacture of micro devices, the pattern formed on the substrate is required to be miniaturized in order to increase the density of the device. In order to meet this requirement, it is desired that the exposure device has a higher resolution. As one of the techniques for realizing this high resolution, a proposal as disclosed in Patent Docume...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/027G03F7/20
Inventor 长坂博之
Owner NIKON CORP