Wafer processing result management method
A management method and chip technology, applied in the direction of semiconductor/solid-state device testing/measurement, etc., can solve the problems of inability to reconfirm the surface quality, time-consuming, etc.
Active Publication Date: 2011-12-28
DISCO CORP
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Therefore, when the notch inspection measurement data is used in production management such as quality confirmation in the mass production process, it takes time to extract and output the notch inspection measurement data from the log data.
In addition, since there is no image information of the notch inspection position, reconfirmation of surface quality, which is indispensable for management, cannot be performed. From the viewpoint of use in quality control, there is a problem of reliability in the use of notch inspection measurement data
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[0026] A wafer processing result management method according to the best mode for carrying out the present invention will be described below with reference to the drawings.
[0027] figure 1 It is a schematic perspective view showing a configuration example of a processing apparatus for implementing the wafer processing result management method according to the embodiment of the present invention, figure 2 is a plan view showing a configuration example of a wafer applied to this embodiment, image 3 It is a schematic front view showing a structural example of a processing device and the like. The processing apparatus 10 of the present embodiment is applied to a dual cut type cutting apparatus for cutting a wafer W along a planned dividing line, and has a basic configuration: a chuck table 11 holding a wafer W, an imaging device 12, and a display panel. 13, processing device 14, processing delivery device 15 (referring to Figure 4 ), indexing conveyor 16 (refer to image ...
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To provide a wafer processing result management method which can visually confirm the temporal change of the surface quality if desired, on the basis that the management of the processing quality during mass production is easy. Each time the cutting groove formed is positioned at the photographing device and photographed, and when the notch inspection is performed (step S108), the generated cutting groove data and image information are associated with the position information, and accumulated and stored in the storage device (step S108). S110), in addition, while displaying the shape of the wafer and the schematic diagram of the planned dividing line as a wafer diagram, a mark indicating the position information of the notch inspection is also displayed on the wafer diagram (step S111), and the The desired notch inspection position is marked, and the cutting groove data and image information can be reproduced on the display panel at the same time.
Description
technical field [0001] The present invention relates to a method for managing wafer processing results in a processing device such as a cutting device. Background technique [0002] A wafer on which a plurality of devices such as ICs and LSIs are formed is formed into a predetermined thickness by back grinding, and is divided into individual devices by a processing device such as a dicing device, and used in electronic devices such as mobile phones and personal computers. Here, when a wafer is cut with a blade by a dicing device, tipping may occur on the cut surface, or the position of the kerf may be changed from the hair line due to the influence of thermal deformation of the spindle or the blade. line) center offset. [0003] Therefore, in the cutting device, the notch inspection of the blade is performed at a predetermined timing. The notch inspection function for cutting condition monitoring is to use an electron microscope to photograph the cutting groove (kerf) cut ...
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IPC IPC(8): H01L21/66
Inventor 宮田谕
Owner DISCO CORP