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Connecting lead wire, method for fabricating same, and solar battery module using the connecting lead wire

A technology for solar cells and connecting leads, applied in circuits, photovoltaic power generation, electrical components, etc., can solve the problems of limiting the freedom of wiring, increasing the wiring space, unsuitable for high-density wiring, etc. The effect of electrical insulation

Inactive Publication Date: 2008-01-16
HITACHI CABLE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when lead wire 131R using an insulating film as shown in FIG. Limits the freedom of wiring and is not suitable for high-density wiring

Method used

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  • Connecting lead wire, method for fabricating same, and solar battery module using the connecting lead wire
  • Connecting lead wire, method for fabricating same, and solar battery module using the connecting lead wire
  • Connecting lead wire, method for fabricating same, and solar battery module using the connecting lead wire

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0114] Embodiment 1 (corresponding to the connection lead wire 21 of FIG. 2 )

[0115] On the Cu wire (central conductor 4) with a conductor diameter of φ1.5mm, the sintered brazing polyurethane enamel paint was repeatedly coated so that the thickness of the brazing polyurethane enamel protective film was 0.04mm, thereby obtaining an enameled wire. The enamel coating layer 5 was removed mechanically at desired positions of the enameled wire, and the enameled wire was cut into lengths of 0.4 m to obtain individualized enameled wires (metal singulation process).

[0116] On the other hand, a solder plating wire with a flat cross-section in which an unillustrated solder plating layer (Sn—Pb molten solder plating layer containing 0.01% by mass of P) was formed on a Cu wire was manufactured, and two were prepared. Root (branch 23b).

[0117] Remove the enamel covering layer 5 on the desired position of the central portion and the end portion of the enameled wire used for the trunk...

Embodiment 2

[0120] Embodiment 2 (corresponding to the connecting lead 31 of FIG. 3 , the connecting lead 41 of FIG. 4 and the connecting lead 61 of FIG. 6 )

[0121] On the Cu line (central conductor 4) that conductor diameter is φ 1.5mm, form the high-melting-point solder coating layer that composition is Sn-3wt%, Ag-0.5wt%, Cu and unavoidable impurity composition by electrolytic plating method, The thickness of the solder plating layer 6 was made to be 0.02 mm. On the high melting point solder plated layer 6 of the high melting point solder plated Cu wire, sintered brazing polyurethane enamel paint was repeatedly applied to obtain an enameled wire. The enameled wire was mechanically removed from several desired positions of the enameled wire, and the enameled wire was cut into lengths of 0.4 m to obtain individualized enameled wires (metal singulation process).

[0122] On the other hand, a solder plating wire having a flat cross section having a solder plating layer (Sn—Pb molten sold...

Embodiment 3

[0128] Embodiment 3 (corresponding to the connection lead wire 51 of FIG. 5 )

[0129] On the Cu wire (center conductor 4) with a conductor diameter of φ1.5mm, a high-melting-point solder coating consisting of Sn and unavoidable impurities is formed by electrolytic plating, so that the thickness of the solder coating 6 is 0.01 mm. On the high melting point solder plating layer 6 of the high melting point solder electroplated Cu wire, sintered brazing polyurethane enamel paint was repeatedly coated so that the thickness of the brazing polyurethane enamel protective film was 0.04 mm, thereby obtaining an enameled wire. The enamel coating layer 5 was removed mechanically at desired positions of the enameled wire, and the enameled wire was cut into lengths of 0.4 m to obtain individualized enameled wires (metal singulation process).

[0130] Select the enameled wire that removes the enamel covering layer 5 at many desired positions as the main body 52, and solder the other enamel...

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Abstract

A connecting lead wire is used for a solar battery module in which a plurality of solar battery cells connected in series by an inter-connector are arranged. The connecting lead wire is provided with a trunk portion and one or more branch portions. In the trunk portion, an enamel coating layer is provided on a conductor. In each of the branch portions, a solder plating layer is provided on a conductor. The branch portion protrudes from the trunk portion in a lateral direction, and connected to an electrode of each of the solar battery cells. The branch portion connects the solar battery cells with each other.

Description

technical field [0001] The present invention relates to a connection lead (connection lead for solar cells) used in a solar cell module of a type in which a plurality of solar cells are connected at high density, a manufacturing method thereof, and a solar cell module using the lead. Background technique [0002] As shown in FIG. 12 , most conventional solar cell modules 120 are composed of solar cell columns in which a plurality of solar cell c is arranged in series or in parallel through interconnectors 121 connected horizontally and bus bars connected vertically. [0003] As conventional connection leads for solar cell modules, there are connection leads 131R provided on the right side of the module main body 120b in the example of FIG. Document 1: JP-A-2003-86820). [0004] The connection lead 131R is used to electrically connect the module main body 120b and a solar cell output cable (not shown) for drawing out current from the module main body 120b. In addition, the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/05H01L31/042H01L31/18
CPCY02E10/50H01L31/05H01L31/0201Y10T29/49355
Inventor 青山正义冲川宽辻隆之西甫
Owner HITACHI CABLE
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