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Packaging structure and radiator piece thereof

A technology of packaging structure and heat sink, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of excessive gap, damage of packaging structure, hindering heat conduction of crystal grain 12, etc., and achieves increased bonding effect and increased contact area , to avoid the effect of damage

Active Publication Date: 2008-02-27
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, when the existing QFP package structure 10 is in a high-temperature and high-humidity environment, the temperature and humidity often lead to changes in the structure of the QFP package structure 10, especially the die load on the main body 22 of the heat sink 18 and the lead frame 14. Delamination (delamination) between parts 14b produces a gap (gap)
For example, when the existing QFP structure 10 is tested for moisture sensitivity level 3 (260° C.) (moisture sensitivity level 3, MSL 3), the gap between the heat sink 18 and the die bearing part 14 b will be too large. Clearance
In this case, the gap prevents the lead frame 14 from being well bonded to the heat sink 18, thereby preventing the heat generated by the die 12 from being conducted to the heat sink 18, and destroying the heat dissipation function of the QFP package structure 10.
What's more serious is that an excessively large gap will not only make the package structure unable to achieve the expected heat dissipation effect, but may also cause damage to the entire package structure

Method used

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  • Packaging structure and radiator piece thereof
  • Packaging structure and radiator piece thereof
  • Packaging structure and radiator piece thereof

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Embodiment Construction

[0019] Relevant detailed description and technical contents of the present invention are as follows now in conjunction with the accompanying drawings:

[0020] The heat sink of the present invention can be applied to various packaging structures such as QFP, TSOP or low-profile quad flat package (LQFP). Taking the QFP structure as an example, please refer to FIGS. 3 and 4 . FIG. 3 is a schematic structural diagram of a QFP structure 30 with a heat sink 38 according to the first embodiment of the present invention, and FIG. 4 is a schematic top view of the heat sink 38 shown in FIG. 3 . As shown in FIG. 3 , the QFP structure 30 generally includes a die 32 , a lead frame 34 , an encapsulant 36 and a heat sink 38 . The lead frame 34 has a plurality of leads 34a and a die carrying portion 34b. The die 32 is disposed on the die carrying portion 34 b of the lead frame 34 , and the die 32 can be fixed on the lead frame 34 by using die attach epoxy or silver glue. In addition, the d...

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PUM

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Abstract

The present invention provides an embedded structure and its thermal fin. The thermal fin includes a main body and several protrusions. The main body surface has at least one trench. The protrusions connect to and extend out of the main body, and each protrusion has several recesses on its surface.

Description

technical field [0001] The present invention relates to a package structure and its heat sink, in particular to a heat sink with at least one groove and several cavities on the surface and a package structure with the heat sink, so as to increase the combination of the heat sink and the package structure stability. Background technique [0002] With the rapid development of electronic products, integrated circuits (ICs) have become indispensable products in the digital age. From information appliances, personal computers to central data exchange systems that process complex signals, etc., traces of integrated circuits can be seen everywhere. Generally speaking, integrated circuits are packaged in a package structure to protect the fragile electronic circuits in the integrated circuit, and at the same time provide a way for the integrated circuit to be electrically connected to an external circuit, so that the integrated circuit can obtain power supply and input from the ext...

Claims

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Application Information

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IPC IPC(8): H01L23/367H01L23/31H01L23/488
CPCH01L2224/48091H01L2224/48247
Inventor 刘承政刘俊成陈星豪陈志明
Owner ADVANCED SEMICON ENG INC