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Leadless tin-base soft solder

A lead-free tin-based, soft solder technology, used in welding/cutting media/materials, welding media, metal processing equipment, etc. question

Inactive Publication Date: 2008-03-05
ZHEJIANG ASIA GENERAL SOLDERING & BRAZING MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention will solve problems such as poor ball forming performance and large diameter deviation of the Sn-3.0Ag-0.5Cu lead-free solder solder used in the known BGA technology, and provides the lead-free tin-based solder solder of the present invention for this reason , the use of this solder can obtain BGA solder balls with good surface quality, excellent ball forming performance and small diameter deviation

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Put 40Kg of Sn and 10Kg of Ag into an alumina crucible, and put it into an intermediate frequency furnace for melting, the melting temperature is 700°C, and the holding time is 1.5 hours. Sn-Ag master alloy.

[0032] Put 45.0Kg of Sn and 5.0Kg of Cu into an alumina crucible, put it into an intermediate frequency furnace for melting, the melting temperature is 750°C, keep it warm for 2 hours, fully stir it, take it out of the furnace, and cool it to make Sn-Cu containing 10% Cu master alloy.

[0033] Put 49.5Kg of Sn and 0.5Kg of RE into an alumina crucible, put it into a vacuum medium frequency induction melting furnace for melting, the melting temperature is 800°C, keep it warm for 1.5 hours, fully stir it, take it out of the furnace, and cool it to make a product containing 1% RE Sn-RE master alloy.

[0034] Put 49.5Kg of Sn and 0.5Kg of Ge into an alumina crucible, put it into an intermediate frequency furnace for melting, the melting temperature is 600°C, keep it ...

Embodiment 2

[0038] Get Sn-Ag master alloy 1.225Kg in embodiment 1, Sn-Cu master alloy 0.400Kg, Sn-RE master alloy 0.900Kg, Sn-Ge master alloy 0.250Kg, Sn-Bi master alloy 0.035Kg and pure tin 4.700Kg, Put it into a stainless steel pot for melting, the melting temperature is 600°C, and the holding time is 1 hour. After fully stirring, it is released from the furnace and cast on a steel welding rod mold to obtain lead-free tin-based solder rods.

Embodiment 3

[0040] Get Sn-Ag master alloy 0.625Kg in embodiment 1, Sn-Cu master alloy 0.200Kg, Sn-RE master alloy 0.030Kg, Sn-Ge master alloy 0.010Kg, Sn-Bi master alloy 0.45Kg and pure tin 4.810Kg, Put it into a stainless steel pot for melting, the melting temperature is 600°C, and the holding time is 1 hour. After fully stirring, it is released from the furnace and cast on a steel welding rod mold to obtain lead-free tin-based solder rods.

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Abstract

The no-lead Sn-base soft solder for preparing BGA tin ball consists of Ag 1.1.5-5.0 wt%, Cu 0.3-0.9 wt%, RE 0.001-0.2 wt%, Ge 0.001-0.2 wt%, and Sn for the rest. Or, it consists of Ag 2.1.5-5.0 wt%, Cu 0.3-0.9- wt%, RE 0.001-0.2 wt%, Ge 0.001-0.2 wt%, Bi 0.05-1.5 wt%, and Sn for the rest. The present invention is suitable for no-lead assembling and packaging in electronic industry.

Description

[0001] The invention relates to a solder alloy, in particular to a lead-free tin-based solder alloy, which is mainly used for lead-free assembly and packaging in the electronic industry. Background technique [0002] BGA packaging technology was successfully developed by Motorola of the United States and Citigen Watch of Japan in the 1990s. Solder balls are used to replace the pins in the packaging structure of IC components to achieve electrical and mechanical connections of components, thereby solving the problem of high components. The problem of density packaging has been widely used in notebook computers, mobile phones, PDAs, DSCs, LCDs, and 3C products. The traditional solder balls for BGA packaging are tin-lead solder. However, people are more and more concerned about the pollution of lead to the environment and the damage to health. In recent years, many countries in the world have successively issued a series of laws and regulations to prevent and control the ecologi...

Claims

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Application Information

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IPC IPC(8): B23K35/26
Inventor 王大勇顾小龙
Owner ZHEJIANG ASIA GENERAL SOLDERING & BRAZING MATERIAL
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