Leadless tin-base soft solder

A lead-free tin-based, soft solder technology, used in welding/cutting media/materials, welding media, metal processing equipment, etc. question

Inactive Publication Date: 2008-03-05
ZHEJIANG ASIA GENERAL SOLDERING & BRAZING MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention will solve problems such as poor ball forming performance and large diameter deviation of the Sn-3.0Ag-0.5Cu lead-free solder solder used in the known BGA technology, and provides the lea

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0030] Example 1

[0031] Put 40Kg of Sn and 10Kg of Ag into an alumina crucible, and put it into an intermediate frequency furnace for smelting. The smelting temperature is 700℃, and the holding time is 1.5 hours. After fully stirring, it is taken out of the furnace and cooled to produce a 20% Ag-containing Sn-Ag master alloy.

[0032] Put 45.0Kg of Sn and 5.0Kg of Cu into an alumina crucible, smelt in an intermediate frequency furnace at a smelting temperature of 750°C, hold for 2 hours, fully stir and release from the furnace, and cool to produce Sn-Cu containing 10% Cu Master alloy.

[0033] Put 49.5Kg of Sn and 0.5Kg of RE into an alumina crucible, put them in a vacuum medium frequency induction melting furnace for smelting at a melting temperature of 800°C, holding for 1.5 hours, fully stirring, and then out of the furnace, cooling to produce 1% RE Sn-RE master alloy.

[0034] Put 49.5Kg of Sn and 0.5Kg of Ge into an alumina crucible, put them in an intermediate frequency fu...

Example Embodiment

[0037] Example 2

[0038] Take the Sn-Ag master alloy 1.225Kg, Sn-Cu master alloy 0.400Kg, Sn-RE master alloy 0.900Kg, Sn-Ge master alloy 0.250Kg, Sn-Bi master alloy 0.035Kg and pure tin 4.700Kg in Example 1, Put it into a stainless steel pot for smelting, the smelting temperature is 600°C, and the holding time is 1 hour. After being fully stirred, it is taken out of the furnace and cast on a steel electrode mold to obtain a lead-free tin-based solder strip.

Example Embodiment

[0039] Example 3

[0040] Take the Sn-Ag master alloy 0.625Kg, Sn-Cu master alloy 0.200Kg, Sn-RE master alloy 0.030Kg, Sn-Ge master alloy 0.010Kg, Sn-Bi master alloy 0.45Kg and pure tin 4.810Kg in Example 1, Put it into a stainless steel pot for smelting, the smelting temperature is 600°C, and the holding time is 1 hour. After being fully stirred, it is taken out of the furnace and cast on a steel electrode mold to obtain a lead-free tin-based solder strip.

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Abstract

The no-lead Sn-base soft solder for preparing BGA tin ball consists of Ag 1.1.5-5.0 wt%, Cu 0.3-0.9 wt%, RE 0.001-0.2 wt%, Ge 0.001-0.2 wt%, and Sn for the rest. Or, it consists of Ag 2.1.5-5.0 wt%, Cu 0.3-0.9- wt%, RE 0.001-0.2 wt%, Ge 0.001-0.2 wt%, Bi 0.05-1.5 wt%, and Sn for the rest. The present invention is suitable for no-lead assembling and packaging in electronic industry.

Description

[0001] The invention relates to a solder alloy, in particular to a lead-free tin-based solder alloy, which is mainly used for lead-free assembly and packaging in the electronic industry. Background technique [0002] BGA packaging technology was successfully developed by Motorola of the United States and Citigen Watch of Japan in the 1990s. Solder balls are used to replace the pins in the packaging structure of IC components to achieve electrical and mechanical connections of components, thereby solving the problem of high components. The problem of density packaging has been widely used in notebook computers, mobile phones, PDAs, DSCs, LCDs, and 3C products. The traditional solder balls for BGA packaging are tin-lead solder. However, people are more and more concerned about the pollution of lead to the environment and the damage to health. In recent years, many countries in the world have successively issued a series of laws and regulations to prevent and control the ecologi...

Claims

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Application Information

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IPC IPC(8): B23K35/26
Inventor 王大勇顾小龙
Owner ZHEJIANG ASIA GENERAL SOLDERING & BRAZING MATERIAL
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