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Substrate processing method and substrate processing apparatus

A substrate processing method and substrate technology, applied in the direction of cleaning methods and appliances, chemical instruments and methods, cleaning methods using liquids, etc., can solve the problems that watermarks cannot be reliably prevented from being generated, pure water cannot be removed, and so on. , Prevent the effect of watermark

Inactive Publication Date: 2008-04-02
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Also, there is a method of suppressing watermark generation by replacing pure water with IPA (isopropyl alcohol) after rinsing treatment, but even in this case, the pure water entering the holes on the substrate cannot be removed, so Does not reliably prevent watermark generation

Method used

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  • Substrate processing method and substrate processing apparatus
  • Substrate processing method and substrate processing apparatus
  • Substrate processing method and substrate processing apparatus

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Experimental program
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no. 1 approach

[0056] (1-1) Structure of substrate processing apparatus

[0057] FIG. 1 is a plan view of a substrate processing apparatus in a first embodiment of the present invention. As shown in FIG. 1 , the substrate processing apparatus 100 has processing areas A and B, and has a transfer area C between the processing areas A and B. As shown in FIG.

[0058] In the processing area A, a control unit 4, fluid cartridge units 2a, 2b, and substrate processing units 5a, 5b are disposed.

[0059] The fluid box parts 2a and 2b in FIG. 1 are used to respectively store and supply processing liquid (including chemical liquid, rinse liquid, and HFE (hydrofluoroether) described later) to the substrate processing part 5a and 5b, and to discard the fluid from the substrate processing part 5a, 5b. Fluid-related equipment such as pipelines, joints, valves, flow meters, regulators, pumps, temperature regulators, and treatment liquid storage containers in 5b.

[0060] Substrate processing using a chem...

no. 2 approach

[0131] Next, a substrate processing apparatus in a second embodiment of the present invention will be described. The substrate processing apparatus in the second embodiment includes substrate processing sections 5 e to 5 h shown below instead of the substrate processing sections 5 a to 5 d shown in FIG. 2 .

[0132] (2-1) Structure of substrate processing unit

[0133] FIG. 7 is a diagram for explaining the configuration of the substrate processing units 5e to 5h. Next, differences between the substrate processing units 5e to 5h and the substrate processing units 5a to 5d (see FIG. 2 ) will be described.

[0134] As shown in FIG. 7 , the shutter 24 and the chuck rotation drive mechanism 36 are not provided in the substrate processing units 5e to 5h.

[0135] In addition, processing cups 123 are provided in the substrate processing units 5 e to 5 h instead of the processing cups 23 . Inside the processing cup 123 is formed a drain recovery space 131 for discarding or recover...

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PUM

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Abstract

Holes having a variety of shapes exist on a surface of a substrate. When pure water is supplied on the substrate in a rinsing process, part of the pure water enters the holes. The pure water which have entered the holes can be hardly shaken off even though the substrate is rotated at a high speed. Therefore, HFE is held on the substrate so as to form an HFE layer after the rinsing process. In this case, the HFE enters the holes while the pure water emerges from the holes to the upper surface of the HFE due to a difference in specific gravity between the pure water and the HFE. Thus, the pure water is reliably prevented from remaining in the holes.

Description

technical field [0001] The present invention relates to a substrate processing method and a substrate processing apparatus for performing predetermined processing on a substrate. Background technique [0002] Conventionally, various processes have been performed on substrates such as semiconductor wafers, glass substrates for photomasks, glass substrates for liquid crystal display devices, and glass substrates for optical discs using substrate processing equipment. [0003] In the substrate processing apparatus, after predetermined processing is performed on the substrate using a chemical solution, the substrate is rinsed using a rinse liquid such as pure water. Thereafter, the substrate is rotated at high speed, and the rinse liquid remaining on the substrate is thrown to the outside of the substrate by centrifugal force, thereby drying the substrate (for example, refer to JP-A-2006-108349). [0004] When the substrate is rotated to shake off the rinse liquid, the directio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/02H01L21/30H01L21/67B08B3/00G02F1/1333H01J9/00G03F1/00G11B7/26H01L21/304
CPCH01L21/68728H01L21/67051H01L21/02057H01L21/68742H01L21/304
Inventor 荒木浩之林豊秀
Owner DAINIPPON SCREEN MTG CO LTD