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Light-emitting device

A technology for light-emitting devices and optical components, applied in semiconductor devices, electrical components, circuits, etc., and can solve problems such as strong radiation

Inactive Publication Date: 2008-04-09
KONINKLIJKE PHILIPS ELECTRONICS NV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, high-power LED chips may emit a lot of heat, and the radiation may be intense

Method used

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  • Light-emitting device

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Embodiment Construction

[0018] Fig. 1 shows a light emitting device 10 according to an embodiment of the invention. The light emitting device 10 may be used for lighting purposes, for example. The light emitting device 10 comprises a light emitting diode (LED) chip 12 connected to an inorganic optical element 14 by means of an adhesive 16 . Here, the inorganic optical element 14 is glued to the light-emitting side 18 of the light-emitting diode chip 12 .

[0019] The inorganic optical element 14 in FIG. 1 is an optical dome for extracting light from the LED chip. However, the inorganic optical element can also take other forms, for example, it can be designed as a flat plate. The light emitting diode chip 12 is preferably of the flip-chip type, and is mounted on a substrate (not shown).

[0020] The adhesive 16 is at least partly transparent or transparent, so that when the light emitting device 10 is in operation, the light generated by the light emitting diode chip 12 is coupled to the optical e...

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Abstract

The present invention relates to a light-emitting device comprising at least one light-emitting diode (LED) chip (12), and an inorganic optical element (14) being connected to the chip(s) by means of a bond (16). The light-emitting device is characterized in that the bond is of a bonding material comprising a matrix including silicon and oxygen atoms with hydrocarbon groups directly bonded to at least a fraction of the silicon atoms. Such inorganic-organic bonding material has very high photo and thermal stability. As a result, high power and high lumen LED chips can be deployed, whereby high brightness light- emitting devices can be realized. The present invention also relates to a method for the manufacture of such light-emitting device.

Description

technical field [0001] The present invention relates to a light emitting device comprising at least one light emitting diode (LED) chip and an inorganic optical element connected to the chip(s) by means of an adhesive, and to the manufacture of A method for such a light emitting device. Background technique [0002] A technical challenge when using light-emitting diodes is to efficiently extract the light generated by the light-emitting diode chip in order to obtain a light-emitting device with sufficient efficacy. Conventional approaches in this regard include the use of primary extraction optics, ie optical domes provided on LED chips, which extract light according to their refractive properties. The materials of these domes are usually based on silicone and polymers such as PMMA. However, these optical domes limit the light-thermal stability, which limits the power of the LED chips used, which in turn limits the light-emitting power of the light-emitting device. [000...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/58
CPCH01L33/58Y10T156/10
Inventor M·A·弗舒伦M·P·J·皮特斯T·A·P·M·柯尔斯滕J·德格拉夫
Owner KONINKLIJKE PHILIPS ELECTRONICS NV