Copper cladded aluminum composite thin flat wire and its preparation method

A copper-clad aluminum, flat wire technology, applied in the direction of flat/ribbon cable, cable/conductor manufacturing, rod/rod/wire/strip conductor, etc., can solve the problem that copper-clad aluminum thin flat wire cannot meet the use of precision micro coils requirements and other issues to achieve the effect of reducing weight, reducing volume and weight, and improving tank full rate

A copper-clad aluminum, flat wire technology, applied in the direction of flat/ribbon cable, cable/conductor manufacturing, rod/rod/wire/strip conductor, etc., can solve the problem that copper-clad aluminum thin flat wire cannot meet the use of precision micro coils requirements and other issues to achieve the effect of reducing weight, reducing volume and weight, and improving tank full rate

CN101169987AActive Publication Date: 2008-04-30UNIV OF SCI & TECH BEIJING
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Preparation of copper-clad aluminum thin flat wire with a size of 0.50×0.022mm.

[0021] (1) Copper tubes with outer diameter and inner diameter of Φ31.4mm and Φ27.6mm respectively, and high-purity aluminum rods with outer diameter of Φ27.6mm are chemically cleaned and mechanically polished and then put together for cooling liquid extrusion compounding. The ratio is 27.4, the extrusion die angle is 90°, and the composite wire billet with a diameter of Φ6.0mm is prepared;

[0022] (2) Carry out multi-pass drawing processing with a speed of 20m / min and a pass diameter reduction ratio of 10%, to prepare a composite wire with a diameter of Φ2.68mm;

[0023] (3) Carry out annealing treatment under the condition that the annealing temperature is 350° C. and the time is 60 minutes;

[0024] (4) Then, the drawing speed is 100m / min, and the pass diameter reduction rate is 15% for multi-pass fine drawing processing, to a diameter of Φ0.3mm;

[0025] (5) The copper-clad aluminum...

Embodiment 2

[0027] Preparation of copper-clad aluminum thin flat wire with a size of 0.085×0.026mm.

[0028] (1) Copper tubes with outer diameter and inner diameter of Φ31.4mm and Φ27.6mm respectively, and high-purity aluminum rods with outer diameter of Φ27.6mm are chemically cleaned and mechanically polished and then put together for cooling liquid extrusion compounding. The ratio is 39, and the extrusion die angle is 90° to prepare a composite wire billet with a diameter of Φ5.0mm;

[0029] (2) Carry out multi-pass drawing processing with a speed of 60m / min and a pass diameter reduction rate of 12%, to prepare a composite wire with a diameter of Φ0.26mm;

[0030] (3) Carry out annealing treatment under the condition that the annealing temperature is 300°C and the time is 60 minutes;

[0031] (4) Then, the drawing speed is 100m / min, and the pass diameter reduction rate is 6% to carry out multi-pass fine drawing processing to a diameter of Φ0.050mm;

[0032] (5) The copper-clad aluminu...

Embodiment 3

[0034] Preparation of copper-clad aluminum thin flat wire with a size of 0.060×0.020mm.

[0035] (1) Copper tubes with outer diameter and inner diameter of Φ31.4mm and Φ27.6mm respectively, and high-purity aluminum rods with outer diameter of Φ27.6mm are chemically cleaned and mechanically polished and then put together for cooling liquid extrusion compounding. The ratio is 61.6, the extrusion die angle is 90°, and the composite wire billet with a diameter of Φ4.0mm is prepared;

[0036] (2) Carry out multi-pass drawing processing with a speed of 100m / min and a pass diameter reduction rate of 30%, to prepare a composite wire with a diameter of Φ0.1mm;

[0037] (3) Carry out annealing treatment under the condition that the annealing temperature is 350°C and the time is 10min;

[0038] (4) Then, the drawing speed is 200m / min, and the pass diameter reduction rate is 5% for multi-pass fine drawing processing, to a diameter of Φ0.030mm;

[0039] (5) The copper-clad aluminum round...

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Abstract

The invention relates to a copper-clad aluminum composite thin flat wire and a preparation method thereof. The copper-clad aluminum composite thin flat wire is composed of a core aluminum body and a pure copper cladding layer, and the pure copper cladding area ratio is 10% to 30%. , the thickness of the copper layer is evenly distributed, the minimum width of the cross-sectional dimension can reach 0.08mm, and the minimum thickness can reach 0.02mm. It is beneficial to reduce the volume and weight of the coil, and can meet the use requirements of micro-motor enameled wires for various precision micro-electrical appliances. The copper-clad aluminum composite thin flat wire is prepared by cold liquid extrusion to prepare copper-clad aluminum wire billet, combined with subsequent cold deformation strong processing (drawing, rolling) to prepare copper-clad aluminum composite thin flat wire, the prepared copper-clad aluminum composite thin The preparation process of the flat wire greatly reduces the number of annealing times, lowers the annealing temperature, and even does not need annealing according to needs, simplifies the production process, and reduces the production cost.

Description

technical field [0001] The invention relates to a double-metal layered composite fine wire, in particular to a copper-clad aluminum composite thin flat wire and a preparation method thereof. Background technique [0002] In recent years, with the rapid development of electronic information technology, electronic precision instruments are becoming more and more miniaturized and lightweight, which puts forward higher requirements for the enameled wires required for micro-motors in small precision electrical appliances. Copper-clad aluminum composite thin flat wire can significantly reduce the weight and volume of the coil due to the advantages of copper's excellent electrical conductivity and low aluminum density, and can meet the requirements for the use of micro-motor enameled wire. It is used in micro-precision instruments, micro-electronic control instruments, Radio components and semiconductor devices have broad application prospects. [0003] At present, most of the mic...

Claims

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Application Information

Patent Timeline
30 Apr 2008
Publication
CN101169987A
IPC
H01B5/02; H01B7/08; H01B13/00
Inventors
刘新华; 谢建新