Saw splitter
A demultiplexer and filter technology, applied in the directions of printed inductors, electrical components, impedance networks, etc., can solve the problem of undisclosed electrode structure, and achieve the effect of reducing the area and occupying a smaller area.
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[0054] Hereinafter, specific embodiments of the present invention will be described with reference to the drawings to clarify the present invention.
[0055] FIG. 1 is a schematic plan view showing a SAW duplexer according to an embodiment of the present invention.
[0056] The SAW splitter 1 has a multilayer packaging substrate 2 . The multilayer packaging substrate 2 is formed of a multilayer ceramic substrate. However, the multilayer package substrate 2 may also be formed using an insulating material other than ceramics.
[0057] On the multilayer package substrate 2 , as indicated by the dotted line, the first SAW filter chip 11 and the second filter chip 12 are mounted by flip-chip bonding. That is, the SAW filter chips 11 and 12 are mounted on the upper surface of the multilayer package substrate 2 using metal bumps. In FIG. 1, the outlines of the SAW filter chips 11 and 12 are indicated by dotted lines as described above.
[0058] The illustrated electrodes are form...
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