Metal conducting wire mosaic structure and method of manufacture

Abstract

The invention relates to a mosaic structure of metal wires, which includes a basement, a dielectric layer and a plurality of metal wires. The dielectric layer is arranged at the basement, which has a plurality of grooves. The metal wires are inlayed in the plurality of grooves. The dielectric layer includes at least two sub-dielectric layers which are positioned by layer-cake and an air gap is kept between at least a sub-dielectric layer and the metal wires. The mosaic structure of the metal wires can effectively reduce capacitance coupling among the metal wires as well as RC delay and leakage current caused by the capacitance coupling. The invention also provides a method for manufacturing the mosaic structure of the metal wires.

Description

technical field [0001] The invention relates to a metal wire inlaid structure and a manufacturing method thereof, in particular to a metal wire inlaid structure for reducing capacitive coupling between metal wires and a manufacturing method thereof. Background technique [0002] In the design of large-scale and ultra-large-scale integrated circuits, the metal wire wiring method mainly adopts the damascene process. The traditional damascene manufacturing process of metal wires is mainly to form a mosaic structure groove for wiring in the dielectric layer, inlay a metal material with better conductivity in the groove, and then remove the excess by chemical mechanical polishing. metal and dielectric layers to form damascene wires, and finally a capping layer is formed on the metal wires. [0003] Please refer to figure 1 , which is a schematic diagram of a metal wire inlaid structure in the prior art, the metal wire inlaid structure 1 includes a substrate 10; a dielectric lay...

AI Technical Summary

Problems solved by technology

[0015] In order to overcome the capacitive coupling between metal wires in the prior art metal wire mosaic structure, the RC delay caused by capacitive coupling and the large leakage current, it is necessary to provide a method that effectively reduces the capacitive coupling between metal wires, and uses capacitive coupling RC delay and leakage current caused by the metal wire damascene structure

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