Integrated circuit device having optically coupled layers
A technology of integrated circuits and devices, applied in the field of coupled signals
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[0013] figure 1 A perspective view of an integrated circuit device 102 according to an embodiment is shown, including an upper layer 106 and a lower layer 104 separated by an insertion layer 105, the height of the insertion layer 105 being enlarged for clarity of presentation. The layers 104 and 106 may be from two different integrated circuit chips that have been glued together, bonded together, or assembled in a vertical arrangement. Alternatively, layers 104 and 106 may be on a common integrated circuit chip. As used herein, the layer of the integrated circuit device refers to the vertically adjacent slab-like sub-volume of the integrated circuit device. It can be appreciated that the layer itself may include multiple material sub-layers with relatively complex structures and functions. Thus, for example, each layer 104 and 106 may include several adjacent sub-layers formed, processed, patterned, or fabricated of different materials to obtain different electrical, electro-o...
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