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Integrated circuit device having optically coupled layers

A technology of integrated circuits and devices, applied in the field of coupled signals

Inactive Publication Date: 2010-10-27
HEWLETT-PACKARD ENTERPRISE DEV LP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, issues arise related to one or more of the optical coupling efficiency and optical crosstalk between different pairs of optical apertures, especially when the vertical separation between opposing layers increases

Method used

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  • Integrated circuit device having optically coupled layers
  • Integrated circuit device having optically coupled layers
  • Integrated circuit device having optically coupled layers

Examples

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Embodiment Construction

[0013] figure 1 A perspective view of an integrated circuit device 102 according to an embodiment is shown, including an upper layer 106 and a lower layer 104 separated by an insertion layer 105, the height of the insertion layer 105 being enlarged for clarity of presentation. The layers 104 and 106 may be from two different integrated circuit chips that have been glued together, bonded together, or assembled in a vertical arrangement. Alternatively, layers 104 and 106 may be on a common integrated circuit chip. As used herein, the layer of the integrated circuit device refers to the vertically adjacent slab-like sub-volume of the integrated circuit device. It can be appreciated that the layer itself may include multiple material sub-layers with relatively complex structures and functions. Thus, for example, each layer 104 and 106 may include several adjacent sub-layers formed, processed, patterned, or fabricated of different materials to obtain different electrical, electro-o...

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Abstract

In an integrated circuit device (102) comprising a vertical arrangement of integrated circuit layers, coupling of an optical signal (S1) between a first integrated circuit layer thereof (104) and a second integrated circuit layer thereof (106 is described. The optical signal (S1) is evanescently coupled between a photonic crystal defect waveguide (110) and a photonic crystal defect cavity (112) in the first integrated circuit layer (104) and projectably coupled between the photonic crystal defect cavity (112) and an optical aperture (116) on the second integrated circuit layer (106).

Description

Technical field [0001] The invention relates to coupling signals between different layers of integrated circuit devices. Background technique [0002] Integrated circuit devices have become important components in a wide range of products from computers and robotics to household appliances and automobile control systems. As integrated circuit devices continue to decrease in physical size and power consumption, they become more useful and faster, so new applications are constantly being discovered. As used herein, an integrated circuit device broadly refers to a device having one or more integrated circuit chips that implement at least one electrical and / or optical function, and includes single-chip and multi-chip devices. In a multi-chip device, each integrated circuit chip is usually manufactured independently from a substrate or "made up" of the substrate, and the resulting chips are combined or otherwise coupled into a common physical configuration. [0003] Integrated circuit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/122G02B6/43
CPCG02B2006/12164G02B6/12002G02B2006/12166B82Y20/00G02B6/1225G02B6/12
Inventor S·M·斯皮莱恩R·G·博索莱尔
Owner HEWLETT-PACKARD ENTERPRISE DEV LP
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