Gallium oxide-zinc oxide sputtering target, method for forming transparent conductive film, and transparent conductive film
A technology of transparent conductive film and gallium oxide, which is applied in the direction of sputtering plating, conductive layer on insulating carrier, circuit, etc., can solve the problems of no effective conductivity of conductive film, disadvantage of manufacturing cost, high price of indium, etc., to achieve Effects of prevention of particle generation, less abnormal discharge, and increased target density
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Embodiment 1~6
[0070] Weigh ZrO with an average particle size of 1 μm or less after pulverization by zirconia media 2 Powder and Ga 2 o 3 powder, zinc oxide (ZnO), to make ZrO 2 The powders were 20 mass ppm (Example 1), 50 mass ppm (Example 2), 200 mass ppm (Example 3), 500 mass ppm (Example 4), 1000 mass ppm (Example 5), and 2000 mass ppm ppm (Example 6), and Ga 2 o 3 is 5% by mass, and the remainder is ZnO, then, using zirconia (ZrO 2 ) balls or beads as the crushing medium, which are mixed and finely crushed with a dynamic crushing classifier to obtain a mixed powder raw meal with a median pore diameter of 0.8 μm.
[0071] The raw meal is granulated to obtain a spherical granulated powder. Further, the granulated powder is press-molded, and then CIP (cold isostatic pressing) is performed. Then, the molded body was sintered in an air atmosphere at temperatures of 1400° C., 1450° C., and 1500° C. for 5 hours, respectively, to obtain sintered bodies. This sintered body is ground and ...
Embodiment 7
[0102] Weigh ZrO with an average particle size of 1 μm or less after pulverization with zirconia media 2 Powder 500 mass ppm and Ga 2 o 3 Powder 5% by mass, the balance is zinc oxide (ZnO), then, use zirconia (ZrO 2 ) balls or beads as the crushing medium, which are mixed and finely crushed with a dynamic crushing classifier to obtain a mixed powder raw meal with a median pore diameter of 0.8 μm.
[0103] In the same manner as in Examples 1 to 6, this raw meal was granulated to obtain spherical granulated powder. Further, the granulated powder is press-molded, and then CIP (cold isostatic pressing) is performed. Then, the molded body was sintered at a temperature of 1500° C. for 5 hours in a nitrogen atmosphere to obtain a sintered body.
[0104] This sintered body is ground and cut, and processed into a sputtering target of a predetermined shape.
[0105] Then, the characteristics of the target and the characteristics during sputtering were examined in the same manner as...
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