70results about How to "Avoid particles" patented technology

This invention provides lateral flow filters with pore size gradients and with features to prevent peripheral flows around the filter. The filters can be laminated composites of two or more planar filter layers. Cartridges employing the filters can include a filtration chamber configured to retain the lateral flow filters including a port for sample application and a capillary channel for filtrate egress. The fluid egress port can be positioned to receive filtrate from one filter layer but not another.

A medical device includes an elongate member defining a lumen and a tipless basket having a proximal end and a distal end. The basket is retractable within and extendable from the lumen. The basket includes a plurality of proximal legs extending from the proximal end of the basket and a plurality of distal legs extending to the distal end of the basket. Each of the plurality of proximal legs is connected to an end of at least two of the plurality of distal legs between the proximal and distal ends of the basket.

The invention relates to the field of high molecular sealing materials and discloses a single-component silane modified polyether sealant composition and a sealant prepared from the single-component silane modified polyether sealant composition. The single-component silane modified polyether sealant composition disclosed by the invention is prepared from silane modified polyether resin, alkoxy terminated polydimethylsiloxane, a plasticizing agent, reinforcing filler, a water removal agent, a light stabilizing agent, an ultraviolet absorbent, a coupling agent and a catalyst. The sealant disclosed by the invention has the advantages of good smell, good ageing resistance, high recovery rate and the like.

A dual emission display includes a substrate, a first light emitter, a second light emitter and a cap. The two light emitters are disposed on the substrate. The first light emitter has a first light-emitting direction. The second light emitter is adjacent to the first light emitter, and has a second light-emitting direction. The cap is located on the first emitter and the second emitter, and is separated from one of the first emitter and the second emitter by a distance ranging from about 1 μm to 100 μm.

The present invention discloses the continuous production process of one kind of mist cured single-component silicone composition. The materials for the mist cured single-component silicone composition are added into one continuous production line for reaction to produce the mist cured single-component silicone composition. The materials include polysiloxane, stuffing, plasticizer, crosslinking agent, coupling agent and catalyst; and the continuous production line includes one serial double screw extruder set, one metering unit, one cooler and one packing unit. The present invention has high production efficiency, great production capacity, low material and power consumption, low cost and stable product quality, and is suitable for industrial production.

The invention solves a problem that a target made by a prior art leaves its peripheral part unsputtered and consequently uneroded, when sputtered after having been mounted on a sputtering apparatus and surrounded by an earth shield, because when plasma is generated, an electric current passes to the earth shield from the target and the plasma is not formed on the surface of the peripheral part of the target. The sputtering target T has a predetermined outer shape which has a slope T2 formed on the whole periphery at which a sputtered surface intersects with a peripheral wall surface.

The present invention provides a method of moving a cutter blade along a circumferential edge of a semiconductor wafer, thereby cutting a protective tape joined to a surface of the semiconductor wafer with a pattern formed thereon for protecting the pattern before the semiconductor is processed. The cutter blade moves in the state where a side face thereof is brought into contact with the circumferential edge of the semiconductor wafer, thereby cutting the protective tape joined to the surface of the semiconductor wafer.

The invention discloses super-abrasion-resistant anti-fouling UV-cured coating. The super-abrasion-resistant anti-fouling UV-cured coating comprises A component clear varnish and B component abrasion-resistant matting paste; the A component clear varnish is mainly prepared from the following raw materials: organosilicone polyurethane acrylate oligomer, polyurethane acrylate, epoxy acrylate, an acrylate monomer, an organic solvent, an nitiator and a leveling agent; and the B component abrasion-resistant matting paste is mainly prepared from the following raw materials: organosilicone polyurethane acrylate oligomer, a silane coupling agent, high-hardness powder, matt powder, an organic solvent, a dispersant, an anti-settling agent and an antifoaming agent. According to the super-abrasion-resistant anti-fouling UV-cured coating, the organosilicone polyurethane acrylate oligomer is introduced into the UV-cured coating, thus resin has the low surface tension, the good anti-fouling propertyis given to a coating coat, super-high hardness and abrasion resistance are given to a paint film, and durability of the anti-fouling effect of the finish paint coating can be achieved.

Disclosed is a high-density gallium oxide-zinc oxide sintered body sputtering target for forming a transparent conductive film. This sputtering target is characterized by containing 20-2000 mass ppm of zirconium oxide. By adding a small amount of a specific element to a gallium oxide (Ga2O3)-zinc oxide (ZnO) sputtering target (GZO type target) for forming a transparent conductive film, the conductivity and bulk density of the target can be improved. In other words, it is disclosed a sputtering target wherein the sintering density is improved and formation of nodules is suppressed by improving the components composition, thereby preventing abnormal discharge and formation of particles. Also disclosed are a method for forming a transparent conductive film by using such a target, and a transparent conductive film formed by such a method.

Disclosed is an electrostatic chuck that makes point contact with a substrate by using a plurality of support balls to minimize the contact area so as to prevent contact damage to the semiconductor substrate; a substrate support; A fixture for securing the sheet; and a method of manufacturing the same. In addition, an electrode structure used as an upper electrode or a lower electrode provided in a plasma processing apparatus and a method of manufacturing the same are disclosed.

The present invention provides method of generating threshold matrix and recording medium storing data of threshold matrix. In a matrix area (720), a plurality of highlight-side dot centers (731) and a plurality of shadow-side dot centers (741) are regularly arranged and a plurality of reference points (751) are set while being distributed almost uniformly. Each of the dot centers (731, 741) is rotated about a nearest reference point (751). Threshold values of the matrix area (720) are determined so that halftone dot areas should be changed around a plurality of highlight-side dot centers (731) after being rotated in accordance with the variation in gray level on the highlight side and a halftone dot area (i.e., joined dot areas) should be changed around a plurality of shadow-side dot centers after being rotated in accordance with the variation in gray level on the shadow side. In a halftone dot image generated by using the matrix area which is thus generated, it is possible to suppress moire and graininess.

A device and method for inhibiting particle (e.g., sand) accumulation on down hole equipment, such as an ESP, particularly when the equipment is not in use. The device and methods permit the equipment to start and stop with fewer break downs and at greater efficiency. The device includes a central tubular section connecting the equipment to the production tubing string. The tubular section is surrounded by an annulus and a number of ports in the tubular section angled to allow fluid communication between the tubular section and the annulus during operation, but prevent particles from flowing from the annulus into the tubular section when not in use. A check valve between the tube and ESP assists in isolating the ESP from sand.

This invention relates to a pre-location systm for silicon chips combined by multiple sensor data, in which, a sensor module connects detected Si chip information to a signal regulation module to regulate it then to be connected to a data collecting module to convert the signals to data and output them to a chip like core notch computation module to process the data to get the regulation volume of a movement control module to be output to it to finish the actual operation for locating the chip, a limit control module diagnoses limits and eliminates fault for the movement control module, which outputs part signals to a signal process module to provide outer clock signal for the data collection module.

The present invention provides a pressure reduction vessel and a pressure reduction processing apparatus which can prevent the grain generated by distortion of the vessel. A O-shape ring (90) is inserted into a groove (26) on the top end surface (21a) of the vessel main body (21) formed in the inner space enclosing a load locking chamber (20) as a sealing component, outside of the ring, a L-shape section shape pad (91) is partly inserted into the groove (26) and the inner angle side surface of the L-shape is partly contacted to the place between the inner wall surface of the groove (26) and the top end surface (21a) of the vessel main body (21). The vessel main body (21) is separated from the top plate (22) by the pad (91), therefore, even the inside of the load locking chamber (20) is reduced to high vacuum status, the top plate (22) generates bending, the angle part (21b) of the inner circumferential side of the vessel main body (21) can be prevented from contacting with the top plate (22).

The invention discloses an adjustable pulverizer, and relates to the field of machining equipment. The adjustable pulverizer comprises a shell and an outer barrel. The outer barrel is movably arranged in the shell and cannot rotate. The inner surface of the outer barrel is in the shape of a funnel. An elastic device is arranged between the inlet end of the outer barrel and the outer barrel. Bolts are arranged at the outlet end of the outer barrel and arranged on the shell in a penetrating mode. The outer ends of the bolts extend out of the shell, and sleeved with nuts. A conical grinding roller matched with the outer barrel is further mounted in the outer barrel. A material channel is formed between the conical grinding roller and the outer barrel. A material inlet and a material outlet communicating with the material channel are formed in the shell. A drive device is further arranged on and connected with the conical grinding roller. By adoption of the adjustable pulverizer, the width of the material channel can be effectively adjusted, the structure is simple, the pulverizing effect is good, and the pulverizing efficiency is high.

The invention provides a flexible display motherboard and a manufacturing method of a flexible display screen, belonging to the technical field of flexible display screens. The flexible display motherboard comprises a carrier substrate, a flexible substrate, and a display device arranged on the flexible substrate; a plurality of heating resistors are arranged between the carrier substrate and theflexible substrate; a bonding force formed by the heating resistors and the carrier substrate is greater than that formed by the heating resistors and the flexible substrate; the flexible substrate isprovided with extension parts filled between the adjacent heating resistors; a hydrogen bond is formed by molecular chain structures of the extension parts and a molecular chain structure of the carrier substrate; the heating resistors are used for heating the carrier substrate and the flexible substrate, so that the hydrogen bond is destroyed by heat generated by the heating resistors. Accordingto the flexible display motherboard and the manufacturing method of the display screen, the flexible substrate can be stripped from the carrier substrate, and the display effect of the flexible display screen can be also improved.