Silicon sheet pre-positioning system based on multiple sensor data fusing
A multi-sensor and data fusion technology, which is applied in the system field of semiconductor lithography technology, can solve the problems that the space size of CCD sensor cannot meet the requirements, limit the space for accuracy improvement, and the sensor sampling frequency is small, etc., and achieve high repeatability accuracy, The effect of improving accuracy and improving overall performance
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[0019] The embodiments of the present invention are described in detail below in conjunction with the accompanying drawings: this embodiment is implemented under the premise of the technical solution of the present invention, and detailed implementation methods and processes are provided, but the protection scope of the present invention is not limited to the following implementations example.
[0020] As shown in Figure 1, this embodiment includes six modules: a sensor module, a signal conditioning module, a data acquisition module, a silicon wafer centroid gap calculation module, a motion control module, and a limit control module. The sensor module connects the detected silicon chip information to the signal conditioning module, the signal conditioning module recuperates the silicon chip information after receiving it, the conditioned signal is connected to the data acquisition module, and the data acquisition module converts the signal conditioned by the signal conditioning...
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