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Fluid-containing cooling plate for an electronic component

A technology of fluids and components, applied in the field of cooling components, which can solve the problem of a large amount of waste

Inactive Publication Date: 2008-06-25
AAVID THERMALLOY LLV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This is labor intensive and results in a lot of scrap, and is only reasonable for prototypes

Method used

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  • Fluid-containing cooling plate for an electronic component
  • Fluid-containing cooling plate for an electronic component
  • Fluid-containing cooling plate for an electronic component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] figure 1 Shown is a base plate 10 having: an inner surface 12 to which a wicking structure 16 of openpore copper foam is diffusion bonded; an opposing surface 13; A pair of laterally opposite notches 14. The wire 20 is formed as a circuit that is disposed against the inner surface 12 closest to the outer periphery of the base plate 10, the structure 16 being spaced from the wire wall 20 to form a gap so that the brazing alloy does not penetrate. capillary structure. The wire can have any external cross-section, such as circular, elliptical, square, rectangular, triangular, trapezoidal or rhombus, as long as it has consistent dimensions transversely to the inner surface 12 . From the viewpoint of commercial availability as wire rods, circular cross-section wire rods are preferable, which are easy to bend into any desired shape and keep the spacing of the plates. A tubular material having one of a variety of outer cross-sections may also be used instead of a solid core...

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PUM

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Abstract

A fluid-containing cooling plate includes a bottom plate, a top plate, and metal wire or tubing formed into a circuit and sandwiched between the plates to form a chamber. The wire is plated or otherwise coated with a brazeable or solderable alloy which bonds it to the plates when the assembly is heated, thereby sealing the chamber. To make a two-phase cooling plate, slugs of plated metal are placed in the chamber and are bonded to the plates to provide support against collapse. The chamber is provided with a wicking structure, and is partially filled with an evaporable fluid via an inlet. A partial vacuum is then drawn, and the inlet is closed off. To make a single-phase cooling plate, wire partitions serving as baffles are provided in lieu of the slugs. These partitions can be arranged to provide a serpentine flow path between the inlet and an outlet, and are likewise plated with an alloy which melts to bond them to the plates.

Description

technical field [0001] The present invention relates to a cooling assembly, which may be embodied as a two-phase evaporator-type cooling plate with sealed chambers containing fluid in liquid and gaseous phases, or as a single-phase cooling plate with chambers, wherein A fluid in liquid phase is circulated through the chamber and the cooling assembly may alternatively be embodied as a pumped cooling plate with an inlet for receiving the liquid and an outlet for the gas. The invention also relates to a method for manufacturing these types of cooling plates. Background technique [0002] As the term is used herein, a cooling plate refers to a part whose length and width are significantly greater than its thickness and which serves to cool a heat source attached to one of its major surfaces. Cooling plates are known which have chambers containing a working fluid which takes part in the heat transfer. Fluids can exist both in liquid and gas phases, or in liquid phases only. It...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28F7/00F28F3/00F28F3/14F28D15/00F28D1/02H05K7/20
CPCH01L2924/0002F28F3/12H01L2924/00
Inventor 布拉德利·R·惠特尼伦道夫·H·库克约翰·R·善那莫苏克维恩德·S·康
Owner AAVID THERMALLOY LLV
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