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Electronic component mounting method

A technology for electronic component installation and electronic components, which is applied in the direction of electrical components, electrical component assembly of printed circuits, electric solid devices, etc., can solve problems such as poor joints, poor electrical conductivity, and insufficient welding strength, and achieve the effect of preventing poor joints

Inactive Publication Date: 2008-07-09
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This can easily lead to poor electrical conductivity or poor bonding, such as insufficient solder strength

Method used

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  • Electronic component mounting method
  • Electronic component mounting method
  • Electronic component mounting method

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Embodiment Construction

[0015] Embodiments of the present invention are explained with reference to the drawings.

[0016] Referring first to Fig. 1, a component mounted board production line is explained. In FIG. 1, a component mounted board production line is configured to have a screen printer M1, an electronic component mounting device M2, and a reflow device M3 arranged in series. The screen printer M1 is used to print solder paste for attaching electronic components to the board. The electronic component placement device M2 is used for mounting electronic components on boards printed with solder paste. The reflow device M3 is used to heat the board on which the electronic components are mounted and fuse the solder component of the solder paste, thereby fixing the electronic components on the board.

[0017] Referring now to FIG. 2, the construction of the electronic component mounting device M2 is explained. In FIG. 2 , the transport path 2 is arranged centrally in the base station 1 along t...

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Abstract

An electronic component mounting method that is to mount on a board 3 an electronic component 11 formed with solder bumps 16 on a lower surface thereof Solder paste 19 is printed onto the electrodes 3a of the board 3 and further provided onto the solder bumps 16 by transfer. Thereafter, the solder bumps 16 are put on the electrodes 3a through the solder paste 19. Due to this, even where there is a gap between the solder bump 16 and the electrode 3a, the fused portion of solder is increased in amount by the solder ingredient of the solder paste 19 wherein the fused portion of solder is ensured to wettably spread. This can prevent a poor junction when to mount a thin semiconductor package by soldering.

Description

technical field [0001] The present invention relates to an electronic component mounting method for mounting an electronic component formed with solder bumps on a board by soldering. Background technique [0002] With recent research and development in size reduction and function improvement of electronic equipment, size and thickness reductions have been achieved for electronic components including semiconductor packages to be mounted in electronic equipment. In addition, further improvement in mounting density is also pursued. As an installation form to cope with such dense installation, there is a trend toward adopting a structure in which board modules are stacked, in which electronic components are mounted on boards (for example, see Patent Document 1). In this patent document, by mounting a plurality of semiconductor packages with solder bumps formed on the board, the component mounting board is given a certain density without increasing the board size. [0003] [Pat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34H01L25/065
CPCH05K2201/035H01L2224/13082H01L2924/01082H01L2224/16145H01L2224/81143H05K2203/0338H01L2224/81801H01L2924/00013H01L21/6835H01L2224/75H01L2924/014H01L2224/11822H01L24/81H01L2224/1308H01L2224/81815H05K1/141H05K2201/10734H05K3/3484H01L2224/75745H01L2924/01005H01L2924/01033H01L2924/01006H01L2224/131H01L2224/8121H05K3/3436H01L24/75H05K3/3485Y02P70/50H01L2224/13099H05K3/34
Inventor 山本佑介
Owner PANASONIC CORP
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