Electronic component mounting method

A technology for electronic component installation and electronic components, which is applied in the direction of electrical components, electrical component assembly of printed circuits, electric solid devices, etc., can solve problems such as poor joints, poor electrical conductivity, and insufficient welding strength, and achieve the effect of preventing poor joints
CN101218862AInactive Publication Date: 2008-07-09PANASONIC CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
PANASONIC CORP
Publication Date
2008-07-09
Estimated Expiration
Not applicable · inactive patent

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Abstract

An electronic component mounting method that is to mount on a board 3 an electronic component 11 formed with solder bumps 16 on a lower surface thereof Solder paste 19 is printed onto the electrodes 3a of the board 3 and further provided onto the solder bumps 16 by transfer. Thereafter, the solder bumps 16 are put on the electrodes 3a through the solder paste 19. Due to this, even where there is a gap between the solder bump 16 and the electrode 3a, the fused portion of solder is increased in amount by the solder ingredient of the solder paste 19 wherein the fused portion of solder is ensured to wettably spread. This can prevent a poor junction when to mount a thin semiconductor package by soldering.
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Description

technical field

[0001] The present invention relates to an electronic component mounting method for mounting an electronic component formed with solder bumps on a board by soldering. Background technique

[0002] With recent research and development in size reduction and function improvement of electronic equipment, size and thickness reductions have been achieved for electronic components including semiconductor packages to be mounted in electronic equipment. In addition, further improvement in mounting density is also pursued. As an installation form to cope with such dense installation, there is a trend toward adopting a structure in which board modules are stacked, in which electronic components are mounted on boards (for example, see Patent Document 1). In this patent document, by mounting a plurality of semiconductor packages with solder bumps formed on the board, the component mounting board is given a certain density without increasing the board size.

[0003] [Pat...

Claims

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