Method of manufacturing bonded body for insulating circuit board, and bonded body for insulating circuit board

A manufacturing method and joint body technology, which can be used in the manufacture of printed circuits, the processing of insulating substrates/layers, and the manufacture of printed circuit precursors, etc., and can solve problems such as poor joints, inability to set guide posts, and imparting loads.
CN111819682APending Publication Date: 2020-10-23MITSUBISHI MATERIALS CORP
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
MITSUBISHI MATERIALS CORP
Publication Date
2020-10-23

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Abstract

This method of manufacturing a bonded body for an insulating circuit board comprises: an aluminum circuit layer forming step of forming, on one surface of a ceramics board, a plurality of aluminum circuit layers; and a copper circuit layer forming step in which a circuit layer copper plate is individually stacked on each of the aluminum circuit layers, the stack is arranged between a pair of backing plates each of which have a convex surface on at least one surface thereof and which are arranged with the convex surfaces opposing each other, and the backing plates are moved in opposing directions to thereby pressurize the stack in the stacking direction and heated in the pressurized state, thereby forming a copper circuit layer in which the circuit layer copper plate is bonded to the aluminum circuit layers by solid-phase diffusion bonding. In the copper circuit layer forming step, the backing plates are arranged such that any of the convex surfaces spans across and abuts against a plurality of circuit layer copper plates adjacent to each other in the stack.
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Description

technical field

[0001] The present invention relates to a method for manufacturing an insulating circuit board assembly such as a power module substrate used in a semiconductor device that controls large current and high voltage, and the insulating circuit board assembly. This application claims priority based on Japanese Patent Application No. 2018-58136 filed on March 26, 2018, and uses the content thereof here. Background technique

[0002] As a substrate for a power module, there is known a substrate in which a circuit layer is bonded to one surface of an insulating layer composed of a ceramic substrate represented by aluminum nitride, and a metal layer for heat dissipation is bonded to the other surface. The layers are bonded with heat sinks.

[0003] For example, in the substrate for a power module with a heat sink disclosed in Patent Document 1, a circuit layer with a double-layer structure of an aluminum layer and a copper layer is formed on one surface of an insula...

Claims

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