Silicon slice cutting method
A cutting method and technology for silicon wafers, which are applied to stone processing tools, manufacturing tools, stone processing equipment, etc., can solve the problems of scratches, waste materials, and affect the use effect of silicon wafers, and achieve neat cuts, simple operations, and avoidance of wasteful effect
Inactive Publication Date: 2008-07-16
BEIJING JIAOTONG UNIV
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Problems solved by technology
However, due to the uneven force of the operator, the silicon wafers are often not cut well, which wastes materials, and secondly, there are often scratches on the cut silicon wafers, which easily affects the use effect
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[0016] The present invention will be further described below in conjunction with accompanying drawing and embodiment:
[0017] In the embodiment shown in Fig. 1, a kind of cutting method of silicon chip comprises steps:
[0018] Step 1, the hard filament 2 adopts medium and low carbon steel wire with a diameter of 2.0mm, straightens it, and fixes its two ends on the operating table with adhesive tape 1;
[0019] Step 2, use a glass knife to lightly spot the center of the BC side of the silicon wafer 3 with a diameter of 100 mm and a thickness of 525 μm to determine the cutting point 4;
[0020] Step 3, placing the silicon wafer 3 on the hard filament 2, so that the cutting point 4 not only coincides with the hard filament 2, but also the A-A direction of the hard filament 2 is perpendicular to the processing edge BC of the silicon wafer 3;
[0021] Step 4, the index finger and the middle finger are lightly applied on both sides of the cutting point 4, and the silicon wafer 3 ...
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Abstract
A silicon wafer cutting method comprises the steps that a hard thin wire (2) is straightened and the two ends thereof are fixed to an operation table with an adhesive tape (1), the margin of the wafer (3) part needed to be cut is slightly marked by a glass cutter to determine the cutting point (4); the wafer is then placed on the hard thin wire (2) and the cutting point (4) is coincided with the hard thin wire (2) and the direction of (A-A) of the hard thin wire (2) is vertical to the direction (BC) of the wafer (3); the two sides of the cutting point (4) is forced slightly by an index figure and a middle figure and the wafer (3), due to the counterforce of the hard thin wire (2), is separated along the crystallizing direction then; then a new cutting point is determined on the new cut part and the wafer can be further cut by repeating the steps till the required size is obtained. By adopting the cutting method, no scratch is generated and the cutting part is regular, which can utilize the wafer materials to the greatest extent and avoid waste. In addition, the cutting method is simple and reliable in operation.
Description
technical field [0001] The invention relates to a method for cutting a silicon chip, in particular to a method for manually cutting a single crystal silicon chip. Background technique [0002] Silicon wafer is one of the most important basic materials in the microelectronics industry, and it is used in many researches. The existing method for cutting silicon wafers is to directly draw lines on the silicon wafers with the aid of tools such as glass knives and rulers during the cutting process, and then cut the silicon wafers. However, due to the uneven force of the operator, the silicon wafer is often not cut well, which wastes materials, and secondly, there are often scratches on the cut silicon wafer, which easily affects the use effect. Contents of the invention [0003] The object of the present invention is to provide a simple and feasible method for cutting silicon wafers, which can not only make the cuts of silicon wafers neat and save materials, but also prevent sc...
Claims
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IPC IPC(8): B28D1/22
Inventor 兰惠清
Owner BEIJING JIAOTONG UNIV