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Gated diode nonvolatile memory with diffusing block structure

A non-volatile memory and diode technology, applied in the field of electrically programmable erasable non-volatile memory, can solve the problem that the size of non-volatile memory cannot be further reduced

Active Publication Date: 2008-07-16
MACRONIX INT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This laterally separated structure is one of the reasons why the size of the non-volatile memory cannot be further reduced

Method used

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  • Gated diode nonvolatile memory with diffusing block structure
  • Gated diode nonvolatile memory with diffusing block structure
  • Gated diode nonvolatile memory with diffusing block structure

Examples

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Embodiment Construction

[0061] 1 is a simplified schematic diagram of a gate diode non-volatile memory cell, with nodes 102 and 104 separated by a junction to form a diode. The combination 106 of the charge storage structure and the dielectric structure substantially surrounds the first node 102 . The charge storage structure and dielectric structure combination 106 is also partially connected to the second diode node 104 . In this cross-sectional view, the dielectric layer 110 on either side of the second diode node 104 isolates the second diode node 104 from adjacent components, such as other gate diode non-volatile memory cells.

[0062] Figure 25 is a simplified gate diode non-volatile memory cell similar to Figure 1, but with a diffusion barrier junction 2501 added to the diode structure.

[0063] 2A , 2B and 2C are simplified schematic diagrams of gate diode nonvolatile memory cells, which show charge storage structures using different materials. In FIG. 2A, the charge trapping material struc...

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PUM

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Abstract

A gated diode nonvolatile memory cell with a charge storage structure includes a diode structure with an additional gate terminal and a diffusion barrier structure between the diode nodes. Example embodiments include the individual memory cell, an array of such memory cells, methods of operating the memory cell or array of memory cells, and methods of manufacturing the same.

Description

technical field [0001] The present invention relates to electrically programmable and erasable non-volatile memory (EEPROM), and more particularly, to a bias arrangement (bias arrangement) of a charge storage memory, which can read with high sensitivity in the charge storage structure of a memory cell. content. Background technique [0002] Electrically programmable and erasable non-volatile storage technologies commonly known as charge storage structures such as EEPROM and flash memory have been widely used. EEPROM and flash memory adopt a certain number of memory cell structures. As the size of integrated circuits shrinks day by day, it becomes more and more important to use the memory cell structure based on the charge trapping dielectric layer because of its advantages of being scalable and easy to manufacture. Various memory cell structures with charge trapping dielectric layers have been adopted in the industry, such as PHINES, SONOS, and the like. These memory cell...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/115H10B69/00
Inventor 高瑄苓蔡文哲欧天凡
Owner MACRONIX INT CO LTD