Welding method and equipment

一种焊接方法、焊接设备的技术，应用在焊接设备、焊接设备、焊接/焊接/切割物品等方向，能够解决不良焊接、结构损伤、热量多等问题，达到提高质量、防止损伤、降低制造成本的效果
CN101234444AActive Publication Date: 2008-08-06SAE MAGNETICS (HK) LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SAE MAGNETICS (HK) LTD
Publication Date
2008-08-06

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Abstract

The present invention relates to a soldering method for bonding each of bonding pads formed in respective bonding targets with solder. The method comprises: a bonding target placing step for placing each of bonding targets to a bonding position; a soldering step for placing solder between each of the bonding pads formed in each of the bonding targets, and for performing soldering by irradiating a heating beam to the solder; and a bonding target heating step for heating at least one of the bonding targets, which is executed before the soldering step and / or simultaneously with the soldering step.
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Description

technical field

[0001] The invention relates to a welding method and welding equipment, in particular to a method and equipment for welding electronic components on an electronic circuit board. Background technique

[0002] Soldering is a common method used to connect electronic components on substrates. Soldering can not only fix the electronic components on the substrate, but also electrically connect the terminals formed on the electronic components and the terminals formed on the substrate. For example, as described below, when manufacturing a head gimbal assembly (headgimbal assembly) carried on a magnetic disk device, a magnetic head as an electronic component can be welded on a suspension (suspension) integrally formed on a flexible printed circuit board slider.

[0003] However, as mentioned above, when the connected body to be soldered is an electronic component, the heating during soldering will make the temperature of the electronic component higher than its hea...

Claims

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