Laser diode and manufacturing method thereof and production chain
A technology of laser diodes and manufacturing methods, which is applied to lasers, laser components, semiconductor lasers, etc., to achieve the effects of simple and practical manufacturing methods, low cost, and quick results
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Embodiment approach 1
[0032] Embodiment 1: As shown in Figures 4 and 5, the laser diode of the present invention includes a protective cover 1 and a base 2, three pins 3 are provided under the base 2, a movement is provided inside the protective cover 1, and the outer edge of the base 2 is There are three positioning grooves 701, 702 and 703, which are characterized in that: the outer edge part containing the positioning grooves 701, 702 and 703 is punched off, the outer diameter of the base 2 is slightly larger than the outer diameter of the protective cover 1, and it is a stepped cylinder shape.
Embodiment approach 2
[0033] Embodiment 2: As shown in Figures 6 and 7, the laser diode of the present invention includes a protective cover 1 and a base 2, three pins 3 are provided under the base 2, a movement is provided inside the protective cover 1, and the outer edge of the base 2 is There are three positioning grooves 701, 702 and 703 on the top, and the feature is that the outer edge part containing the positioning grooves 701, 702 and 703 is punched off, and the outer diameter of the protective cover 1 is equivalent to that of the base 2 and is cylindrical.
[0034] The difference between embodiment one and two is that the amount of punching is different. The punching amount of the former is smaller than that of the latter.
[0035] The manufacture method of laser diode of the present invention, comprises the following steps:
[0036] ①. Make a base with a positioning groove;
[0037] ②. Install the die and pins on the base;
[0038] ③. Install a protective cover on the base;
[0039] ...
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