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Laser diode and manufacturing method thereof and production chain

A technology of laser diodes and manufacturing methods, which is applied to lasers, laser components, semiconductor lasers, etc., to achieve the effects of simple and practical manufacturing methods, low cost, and quick results

Inactive Publication Date: 2008-08-20
谌红艳
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The crux of the above problems is that the LD industry generally believes that each outer diameter specification requires a special mold and a special production line for production.

Method used

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  • Laser diode and manufacturing method thereof and production chain
  • Laser diode and manufacturing method thereof and production chain

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Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0032] Embodiment 1: As shown in Figures 4 and 5, the laser diode of the present invention includes a protective cover 1 and a base 2, three pins 3 are provided under the base 2, a movement is provided inside the protective cover 1, and the outer edge of the base 2 is There are three positioning grooves 701, 702 and 703, which are characterized in that: the outer edge part containing the positioning grooves 701, 702 and 703 is punched off, the outer diameter of the base 2 is slightly larger than the outer diameter of the protective cover 1, and it is a stepped cylinder shape.

Embodiment approach 2

[0033] Embodiment 2: As shown in Figures 6 and 7, the laser diode of the present invention includes a protective cover 1 and a base 2, three pins 3 are provided under the base 2, a movement is provided inside the protective cover 1, and the outer edge of the base 2 is There are three positioning grooves 701, 702 and 703 on the top, and the feature is that the outer edge part containing the positioning grooves 701, 702 and 703 is punched off, and the outer diameter of the protective cover 1 is equivalent to that of the base 2 and is cylindrical.

[0034] The difference between embodiment one and two is that the amount of punching is different. The punching amount of the former is smaller than that of the latter.

[0035] The manufacture method of laser diode of the present invention, comprises the following steps:

[0036] ①. Make a base with a positioning groove;

[0037] ②. Install the die and pins on the base;

[0038] ③. Install a protective cover on the base;

[0039] ...

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Abstract

The present invention relates to a laser diode and the preparing method and the product line thereof. The technical problem to be settled by the invention is how to overcome the bias of the existing technique and provide a laser diode and the preparing method and the product line thereof. The method for preparing the laser diode is characterized in that when the base is installed with a protective cover the outer margin part of the base including the locating groove is press-cut before testing and packaging thereby obtaining the purpose of reducing the radial dimension. The laser diode product line of the invention is characterized in that a press cutting unit with outer diameter of the press knife a little larger than the outer diameter of the protective cover of the laser diode to be processed is included. The laser diode of the invention is characterized in that the outer margin part containing the locating groove is press cut, and the outer diameters of the protective cover and the base are approximate equivalent and are column-shaped. The invention is widely used in the related producing and applying area of the laser diode.

Description

technical field [0001] The invention relates to a laser diode and its manufacturing method and production line. Background technique [0002] As shown in Figure 1-3, the laser diode includes a protective cover 1 and a base 2, three pins 3 are arranged under the base 2, and a movement is arranged inside the protective cover 1, and the movement includes a heat sink 4, a laser chip 5 and The photodiode 6 has three positioning grooves 701, 702 and 703 (referred to as three grooves in the industry) on the outer edge of the base, which play a positioning role in the production process and are used in CD, VCD, DVD and other optical disc reading devices and other lasers. in the device. [0003] Divided by the outer diameter of its base, the commonly used laser diodes have two specifications of 5.6mm and 3.3mm. Each specification has a dedicated mold and production line, and the investment in production equipment can cost millions of dollars. The market price of each LD: 5.6mm-2.5...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/022H01S5/00
Inventor 谌红艳
Owner 谌红艳