Chip fuse and its making method

A fuse and chip-type technology, applied in the manufacture of fuses, emergency protection devices, electrical components, etc., can solve the problems of thermal stress and protective layer damage, high manufacturing costs, etc.

Inactive Publication Date: 2008-09-10
BESDON TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These inventions reduce the thermal stress and protective layer damage problems of the above-mentioned known technologies, but the fuse is still in direct contact with the insulating layer.

Method used

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  • Chip fuse and its making method
  • Chip fuse and its making method
  • Chip fuse and its making method

Examples

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Embodiment Construction

[0060] see figure 2 , figure 2 A perspective view of the chip fuse 2 according to the first preferred embodiment of the present invention is shown. The protective layer 29 is partially cut in the length direction and the width direction to clearly show the internal structure. image 3 for figure 2 Sectional view cut along the width centerline (1-1 line). The chip fuse 2 includes a substrate 21 , a fuse 22 , a cavity 27 , a protective layer 29 , two terminal electrodes 24 and two terminal pads 26 .

[0061] The substrate 21 is electrically insulating, and its material is alumina with a purity of more than 90%, glass, or other electrically insulating ceramic materials, wherein alumina with a purity of 96% is the most suitable, and its thickness is about 0.2 to 1.0 millimeters (mm).

[0062] Fuse 22 is a layer of conductive film, its composition is gold, silver, aluminum, copper, platinum and other pure metal or alloy, also can be silver and glass composite conductor, made...

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Abstract

The invention provides a chip type fuse and a method for the production thereof, which is characterized in that: electrical insulating materials are adopted as base plates of the fuse; fuse wires are arranged on the base plates; a protective layer is formed above the fuse wires and bound with the base plates at the periphery of the fuse wires, therefore, a hollow cavity is formed between the fuse wires and the protective layer; the hollow cavity is used for keeping the protective layer from being directly contacted with the fuse wires as well as to avoid the high heat and electric arcs generated by the fuse wires under the condition of excessive current loading from melting or destroying the protective layer. Moreover, the hollow cavity can also be in sealed status and gas which is less than one atmospheric pressure is sealed inside. In addition, a heat insulating layer and an electric arc damping layer are further arranged for the chip type fuse, so as to respectively reduce the response time and the strength of the electric arcs under the condition of excessive current loading. The invention also provides a method for the production of the chip type fuse, in particular to a method for forming the fuse wires and the hollow cavity. The chip type fuse and the method for the production thereof can avoid the high heat and electric arcs generated by the fuse wires under the condition of excessive current loading from melting or destroying the protective layer, so as to ensure the integrity and the use safety of the parts.

Description

technical field [0001] The invention relates to a chip-type fuse which can be fixed on a circuit board in a surface-mounting manner, in particular to a chip-type fuse structure with hollows above the fuse and a manufacturing method thereof. The hollow space can form a sealed state and contain gas with a pressure of less than 1 atmosphere. Background technique [0002] Fuses are widely used in the electronics and electrical industries to protect products from excessive current damage and possible fire disasters. The principle is that when the current flows through a conductive fuse with appropriate impedance, when the current exceeds the rated specification, the fuse will be blown due to overheating, and the current will be isolated from entering the product. The higher the impedance after burning, the better the isolation effect. Generally, the larger the cross-sectional area of ​​the fuse, the lower the impedance and the higher the rated current. The fuse is connected in...

Claims

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Application Information

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IPC IPC(8): H01H85/04H01H85/041H01H85/05H01H85/055H01H85/143H01H69/02
Inventor 蔡聪明
Owner BESDON TECH CORP
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